Temperature fuse capable of being soldered through reflow

A temperature fuse and reflow soldering technology, which is applied in the direction of heating/cooling contact switches, etc., can solve the problems of thermal fuse blown, reflow soldering cannot be used, and chip-based SMD components cannot be realized, so as to improve the qualified rate of finished products and facilitate The effect of production

Inactive Publication Date: 2012-06-27
SHANGHAI CHANGYUAN WAYON CIRCUIT PROTECTION CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Alloy type temperature fuse is a relatively reliable protection element, and it is non-recoverable. Although it has the disadvantage of only acting once, on the other hand, its safety is greatly improved. It is better not to use the battery whose thermal fuse is blown due to high temperature, because the probabi

Method used

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  • Temperature fuse capable of being soldered through reflow
  • Temperature fuse capable of being soldered through reflow
  • Temperature fuse capable of being soldered through reflow

Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0029] Example 1

[0030] Such as figure 1 As shown, the pins are made of pure nickel material (1, 2) with tin-plated ends, the size is 2.1mm*5mm*0.75mm, the frame-shaped shell size is 3mm*5mm, LCP material (3) is used, and the alloy is SnBiIn The alloy material (4) has a size of 3.8mm*1.8mm*0.3mm, the melting point of the alloy is 98°C, and the cover material is a 0.15mm PET sheet (5). The pins and the frame-shaped shell are connected by injection molding, and the tin-plated end protrudes from the middle of the frame-shaped shell and is close to the bottom of the frame-shaped shell, leaving a distance of 1.3mm in the middle. After adding flux to the pin ends, put in the small alloy sheet (4), cover the PET sheet (5) on the alloy, and apply a certain pressure. Then go through the reflow soldering furnace with the highest temperature of 265℃. After welding, remove the PET sheet and observe the shape of the alloy sheet (4). Those that are basically undeformed or slightly thinner ...

Example Embodiment

[0034] Example 2

[0035] Such as figure 2 As shown, the pins are made of pure nickel material (1, 2) with tin-plated ends, the size is 2.1mm*5mm*0.75mm, the frame-shaped shell size is 3mm*5mm, the Al2O3 material (3) is used, and the nickel leads The gap with Al2O3 is sealed with epoxy resin. The alloy adopts SnBi alloy material (4), the size is 3.8mm*1.8mm*0.3mm, the alloy melting point is 139℃, and the cover material adopts 0.15mm PA sheet (5). The pins and the frame-shaped shell are connected by injection molding, and the tin-plated end protrudes from the middle of the frame-shaped shell and is close to the bottom of the frame-shaped shell, leaving a distance of 1.3mm in the middle. After adding flux to the pin ends, put in the small alloy sheet (4), cover the PET sheet (5) on the alloy, and apply a certain pressure. Then go through a reflow soldering furnace with the highest temperature of 265°C. After welding, remove the PET sheet and observe the shape of the alloy shee...

Example Embodiment

[0039] Example 3

[0040] Such as image 3 As shown, the pins are made of pure nickel material (1, 2) with tin-plated ends, the size is 2.1mm*5mm*0.75mm, the frame-shaped shell size is 3mm*5mm, the Al2O3 material (3) is used, and the nickel leads The gap with Al2O3 is sealed with epoxy resin. The alloy adopts SnBi alloy material (4), the size is 3.8mm*1.8mm*0.3mm, the alloy melting point is 139℃, and the cover material adopts 0.15mm PA sheet (5). The pins and the frame-shaped shell are connected by injection molding, and the tin-plated end protrudes from the middle of the frame-shaped shell and is close to the bottom of the frame-shaped shell, leaving a distance of 1.3mm in the middle. After adding flux to the pin ends, put in the small alloy sheet (4), cover the PET sheet (5) on the alloy, and apply a certain pressure. Then go through a reflow soldering furnace with the highest temperature of 265°C. After welding, remove the PET sheet and observe the shape of the alloy sheet ...

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Abstract

The invention relates to a temperature fuse capable of being soldered through reflow, which comprises a shell and two metallic electrodes, wherein the shell can be used for containing a low-temperature alloy, and the low-temperature alloy is connected with the end heads of the two electrodes. The temperature fuse is characterized by also comprising an upper cover, wherein the upper cover is used for stopping the low-temperature alloy from being fused, the shell is a frame-shaped shell, the metallic electrodes are respectively arranged at the bottom or at both sides of the frame-shaped shell, a space of 0.5 to 2.5mm is left between the electrodes, the low-temperature alloy is filled in the frame-shaped shell, the length and width sizes of the low-temperature alloy are smaller than or equal to the inner length and width of the frame-shaped shell, the thickness size of the alloy is smaller than or equal to the depth of the frame-shaped shell, and the upper cover is buckled and pressed on the low-temperature alloy. The invention also relates to a manufature method of temperature fuse. By removing the upper cover of the temperature fuse, the pressurized state above the low-temperature alloy is released, the temperature inducing and fusing functions of the fuse are activated, the temperature fuse is convenient to manufacture, and the qualified rate of finished products is improved.

Description

technical field [0001] The invention relates to a thermal fuse capable of reflow soldering and a manufacturing method thereof. Background technique [0002] In recent years, the communication industry has developed day by day, especially in the aspect of radio communication, the market of mobile phones has been popularized to almost everyone has a mobile phone. The popularity of mobile phones has directly led to the expansion of the market for mobile phone components, especially mobile phone batteries. [0003] With the development of 3G (third-generation communication) technology, mobile phones are developing towards multi-functionality. Multi-functionality requires further increase in battery capacity of mobile phones. The capacity has surged from 600mAh in the past to the current maximum of 3600mAh. The explosive power of such a high-capacity battery It can be seen. [0004] At present, most mobile phone batteries only rely on over-current protection, that is to say, th...

Claims

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Application Information

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IPC IPC(8): H01H37/76
Inventor 钱朝勇张子川杨彬
Owner SHANGHAI CHANGYUAN WAYON CIRCUIT PROTECTION CO LTD
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