The invention relates to a TGV heating atomization
chip, which comprises a memory
metal heating sheet, a heating
slurry, a conductive
slurry and a high
borosilicate glass structure, the high
borosilicate glass structure is located at the bottom of the TGV heating atomization
chip, the high
borosilicate glass is transparent and can
resist a temperature of more than 500 DEG C, the high borosilicate glass is
cut by a
laser cutting process, and the temperature of the high borosilicate glass is more than 500 DEG C. A
honeycomb structure is arranged in the middle of the high borosilicate
glass structure and consists of a plurality of
honeycomb holes; heating paste is printed on the upper part of the high borosilicate
glass structure, and a heating surface is formed after the heating paste is printed; the printing surface keeps away from the
honeycomb holes when the heating
slurry is printed, and high-temperature
sintering curing is adopted; when the TGV heating atomization
chip is used for heating and atomization, the TGV heating atomization chip has the advantages of being free of liquid leakage, high in
explosive power, sufficient in atomization, little in condensate, small in atomization particle, large in atomization amount, good in taste reduction, free of liquid bubbling, free of hole blocking, free of scorched smell, capable of automatically matching suction resistance and continuous and stable in temperature output, and matching of materials, the technology, application and the like is
safer.