Hot disc and silicon chip heating system applying same

A heating system and silicon wafer technology, applied in electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve problems such as bending deformation, inclination of silicon wafer 12, affecting line width uniformity, etc., to avoid pollution, heat evenly, Avoid the effect of bending deformation

Active Publication Date: 2012-07-04
SHANGHAI MICRO ELECTRONICS EQUIP (GRP) CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

If adopted figure 1 In the hot plate pre-baking device shown, since the edge of the silicon wafer 12 is not supported, the silicon wafer 12 will be bent and deformed when heated, which will affect the flatness of the silicon wafer 12 and the photoresist
In addition, a slight difference in height between the three ejector pins 3 will cause the inclination of the silicon wafer 12, resulting in uneven heating.
Moreover, since the ejector rod 3 is in direct contact with the silicon wafer 12, the contacted part will be heated unevenly, which ultimately affects the uniformity of the line width.

Method used

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  • Hot disc and silicon chip heating system applying same
  • Hot disc and silicon chip heating system applying same
  • Hot disc and silicon chip heating system applying same

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Embodiment Construction

[0030] figure 2 It is a schematic diagram of a silicon wafer heating system according to a preferred embodiment of the present invention. image 3 It is a top view of a heat plate according to a preferred embodiment of the present invention. Please refer to figure 2 and image 3 . In this embodiment, the silicon wafer heating system 1 is used to heat the silicon wafer 2, which includes a housing body 10, a heating plate 11, an air intake fan 12, an exhaust fan 13, a first heating device 14, a first temperature detection device 15, A temperature controller 16 , a second temperature detection device (not shown), an automatic pressure regulating valve (not shown), a silicon chip protection device 19 , a position sensor 20 , a push rod 21 , a driving device 22 and a second heating device 23 . However, the present invention does not make any limitation thereto.

[0031] In this embodiment, the accommodating body 10 is the furnace body of the silicon wafer heating system 1 , ...

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Abstract

The invention provides a hot disc and a silicon chip heating system applying the same. The hot disc is arranged in an accommodating body, and is connected with an exhaust fan and an air inlet machine respectively; the hot disc is provided with multiple groups of uniformly-distributed heating regions; an air outlet hole and an air inlet hole are formed in each heating region; the air outlet hole is connected to the exhaust fan; the air inlet hole is formed around the air outlet hole, and is connected to the air inlet machine; and the air inlet machine is used for supplying hot air. A silicon chip can be suspended above the hot disc without being directly contacted with the hot disc during heating, so that the back face of the silicon chip is prevented from being polluted by a heated disc, and the problem of explosion of the silicon chip is solved.

Description

technical field [0001] The invention relates to a silicon chip heating technology, in particular to a hot plate and a silicon chip heating system using the same. Background technique [0002] In the pattern transfer process of semiconductor chip production, photoresist coating, soft baking and post-baking are very important steps. Soft baking is to evaporate the solvent in the coated photoresist to improve its adhesion, uniformity and etch resistance, thereby improving the control of line width. At present, the photoresists used in 193nm and 248nm lithography machines are optically amplified photoresists. Optically amplified photoresist will generate photoacid (H+) after exposure, and post-baking can diffuse the generated H+ into the interior of the photoresist, making the exposed part of the photoresist an alkali-soluble material. Generally, the length and uniformity of the post-baking time will seriously affect the size and uniformity of the line width. During the bakin...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/00
Inventor 闵金华张俊
Owner SHANGHAI MICRO ELECTRONICS EQUIP (GRP) CO LTD
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