Method for preparing cardanol modified phenolic paper-based copper clad plate

A phenolic paper-based, cardanol technology is applied in chemical instruments and methods, synthetic resin layered products, layered products, etc., and can solve the problems of cardanol ineffectiveness, difficulty in reducing product cost, and increasing the amount of tung oil. , to achieve the effect of improving flexibility, saving tung oil consumption and low price

Active Publication Date: 2012-07-11
江阴市明康绝缘玻纤有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The disadvantage of this method is that cardanol and tung oil are added at the same time during the reaction, and the presence of an acid catalyst will inhibit the reaction of cardanol, making cardanol ineffective, thereby reducing product performance. In order to improve performance, it is often necessary to increase tung oil consumption, the product cost is difficult to reduce

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0029] A kind of preparation method of cardanol modified phenolic paper base copper clad laminate, described method comprises the steps:

[0030] 1. Preparation of modified phenolic resin mixed solution:

[0031] Step A, preparation of cardanol modified phenolic resin

[0032] The raw material mass portion proportioning of described cardanol modified phenolic resin is as follows:

[0033] 1200 parts of phenol;

[0034] Cardanol 800 parts;

[0035] 1500 parts of formaldehyde;

[0036] 2 parts of triethylamine;

[0037] Ammonia 25% concentration 80 parts;

[0038] 1300 parts of methanol;

[0039] During preparation, phenol, cardanol, formaldehyde, triethylamine and ammonia water are added to the reaction kettle for reaction, the reaction temperature is 95-100°C, the reaction time is 40-60 minutes, and then methanol is added as a solvent to obtain a phenolic resin solution;

[0040] Step B, prepare tung oil modified phenolic resin

[0041] First add 260 parts by mass of t...

Embodiment 2

[0048] The preparation method in this embodiment is identical with embodiment 1, and its difference is only in:

[0049] In step A:

[0050] 1100 parts of phenol;

[0051] Cardanol 700 parts;

[0052] 1300 parts of formaldehyde;

[0053] 1.5 parts of triethylamine;

[0054] Ammonia 25% concentration 70 parts;

[0055] 1200 parts of methanol.

Embodiment 3

[0057] The preparation method in this embodiment is identical with embodiment 1, and its difference is only in:

[0058] In step A:

[0059] 1300 parts of phenol;

[0060] Cardanol 900 parts;

[0061] 1500 parts of formaldehyde;

[0062] 2.5 parts of triethylamine;

[0063] Ammonia 25% concentration 90 parts;

[0064] Methanol 1500 parts.

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Abstract

The invention relates to a method for preparing a cardanol modified phenolic paper-based copper clad plate. The method comprises the following steps: step 1), preparing a mixed solution of modified phenolic resin, namely, firstly, preparing cardanol modified phenolic resin, then preparing tung oil modified phenolic resin, then mixing the cardanol modified phenolic resin with the prepared tung oil modified phenolic resin according to a mass ratio of 1:1, then adding epoxidized soybean oil, and fully stirring to obtain the mixed solution of modified phenolic resin; and step 2), preparing the copper clad plate, namely, socking a wood fiber insulation paper in the mixed solution of modified phenolic resin prepared in the step 1), then drying and cutting to prepare a phenolic paper base, and then coating a copper foil on the surface of the phenolic paper base for compressing and molding so as to obtain the finished product. The method for preparing the cardanol modified phenolic paper-based copper clad plate is low in production cost, and the prepared copper clad plate has good flexibility.

Description

technical field [0001] The invention relates to a method for preparing a cardanol-modified phenolic paper-based copper-clad laminate, which is mainly used in the technical field of copper-clad laminate production. Background technique [0002] Copper-clad laminate is a plate material made by impregnating electronic glass fiber cloth or other reinforcing materials with resin, covering one or both sides with copper foil and hot pressing. It is called copper-clad laminate (Copper-clad laminate) Clad Laminate, CCL), referred to as copper clad laminate. [0003] Copper clad laminate is an extremely important basic material for printed circuit boards. Printed circuit boards of various forms and functions are selectively processed, etched, drilled and copper-plated on copper clad laminates. Different printed circuits (single-sided, double-sided, multilayer). As the substrate material in the manufacture of printed circuit boards, copper clad laminates mainly play the role of inter...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B27/10B32B27/42
Inventor 王宏章
Owner 江阴市明康绝缘玻纤有限公司
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