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Laminate and manufacturing method for same

A technology for laminated materials and manufacturing methods, applied in chemical instruments and methods, layered products, thin material processing, etc., can solve problems such as reduced productivity, and achieve the effects of excellent productivity, prevention of deformation, and improved dimensional accuracy

Inactive Publication Date: 2012-07-11
RESONAC HOLDINGS CORPORATION
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] However, in the case of the laminated material described in Patent Document 1, the metal layer is produced by performing spark plasma sintering on metal powder on both sides of a prefabricated ceramic plate, so it is necessary to consider The volume shrinkage of the metal powder may reduce the productivity when considering the improvement of the dimensional accuracy in the thickness direction of the metal layer.

Method used

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  • Laminate and manufacturing method for same
  • Laminate and manufacturing method for same
  • Laminate and manufacturing method for same

Examples

Experimental program
Comparison scheme
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Embodiment approach 1

[0072] The implementation is as Figure 1 ~ Figure 3 shown. figure 1 represents the laminated material of Embodiment 1 of the present invention, figure 2 express figure 1 A method for the manufacture of laminated materials. in addition, image 3 Indicate implementation figure 2 The range of heating temperature during the method.

[0073] figure 1 In the laminated material (1), a plurality of metal plates (2) (3) and at least one ceramic plate (4) are laminated in such a way that the metal plate (2) (3) and the ceramic plate (4) are adjacent, and , Adjacent metal plates (2) (3) and ceramic plates (4) are bonded by spark plasma sintering. Here, in the laminated material (1), two upper and lower metal plates (2) (3) and one ceramic plate (4) are laminated in such a way that the ceramic plate (4) is located between the two metal plates (2) (3) , and the two metal plates (2) (3) and the ceramic plate (4) are bonded by a spark plasma sintering method.

[0074] The flatnes...

Embodiment approach 2

[0097] This embodiment is shown in Figure 8 and Figure 9 . Figure 8 Represents the laminated material of Embodiment 2 of the present invention, Figure 9 express Figure 8 A method for the manufacture of laminated materials.

[0098] Figure 8 Among them, for the laminated material (30), the metal plate (2) (3) of at least any one of the upper and lower two metal plates (2) (3) of the laminated material (1) in Embodiment 1 and On the surface on the opposite side of the joint surface of the ceramic plate (4) (here, the lower surface of the lower metal plate (3)), the metal plate (31) is bonded in a laminated form by the spark plasma sintering method, and the metal plate ( 31) It is formed of a material that does not melt at the heating temperature of the spark plasma sintering method when producing the laminated material (30). That is, when the two metal plates (2)(3) are formed of materials having the same melting point, the metal plate (31) is formed of a material ha...

Embodiment approach 3

[0111] This embodiment is shown in Figure 10 . Figure 10 A laminated material according to Embodiment 3 of the present invention is shown.

[0112] Figure 10 Among them, for the laminated material (35), the metal plate (2) (3) of at least any one of the upper and lower metal plates (2) (3) of the laminated material (1) of embodiment 1 and the ceramic On the surface on the opposite side of the joint surface of the plate (4) (here, the upper surface of the upper metal plate (2)), a high melting point metal plate (36) is bonded in a laminated form by a spark plasma sintering method, and the high melting point metal plate (36) is The metal plate (36) is formed of a material that does not melt at the heating temperature of the spark plasma sintering method when manufacturing the laminated material (35).

[0113] The two metal plates (2) (3) are formed by Al or Al alloy, and the refractory metal plate (36) is made of a material selected from Cu, Ag, Au, Ni, Cu alloy, Ag alloy,...

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Abstract

Disclosed is a laminate (1) in which two metallic sheets (2,3) and one ceramic sheet (4) are stacked so that the ceramic sheet (4) is disposed between the two metallic sheets (2,3), and then joined by spark plasma sintering. The difference between the melting points of the two metallic sheets (2,3) is 140 DEG C or less. The laminate (1) is manufactured by stacking the two metallic sheets (2,3) that have a melting point difference of 140 DEG C or lower and the ceramic sheet (4) so that the ceramic sheet (4) is placed between both metallic sheets (2,3), then disposing the stack of the metallic sheets (2,3) and the ceramic sheet (4) between a pair of electrodes in a spark plasma sintering device, and bonding the metallic sheets (2,3) and the ceramic sheet (4) by passing a pulse current between the electrodes while maintaining the conduction between the electrodes.

Description

technical field [0001] The present invention relates to a laminated material and a method for producing the same, and relates to a laminated material for cooling semiconductor elements such as LEDs and power supply devices, and a method for producing the same. [0002] In the present specification and claims, the materials represented by element symbols represent pure materials, but industrial pure materials containing unavoidable impurities are also included. [0003] In addition, in this specification and claims, the spark plasma sintering method (Spark Plasma Sintering) is not limited to a method of actually sintering powder, but refers to a method utilizing the principle of spark plasma sintering. [0004] Furthermore, in the present specification and claims, the term "melting point" refers to the solidus temperature in the case of an alloy. Background technique [0005] For example, as a laminated material composed of a ceramic layer and a metal layer, the present appl...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B15/04C04B37/02H01L23/12
CPCC04B2237/403C04B2237/366C04B2235/666C04B2237/361C04B2235/963C04B37/021C04B2237/343C04B2237/368C04B2237/405C04B2237/408C04B2237/365C04B2237/52C04B2237/34H01L23/3735C04B2237/407C04B2237/402H01L2924/0002Y10T428/12535H01L2924/00
Inventor 铃木大介大山茂大泷笃史
Owner RESONAC HOLDINGS CORPORATION