Electrical component and method for manufacturing electrical components
A technology of electrical components and manufacturing methods, which is applied in the directions of electrical components, electrical solid-state devices, semiconductor/solid-state device components, etc., can solve the problems of deviation in the quality of electrical components, difficulty in fully suppressing metal whiskers, etc., so as to suppress the occurrence of metal whiskers. Effect
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Embodiment 1
[0066] As the base material, a phosphor bronze tape formed by connecting a plurality of parts that should serve as contacts for the post via connecting parts was used. After the degreasing and acid cleaning of the phosphor bronze strip, copper strike plating (plating thickness 0.1 μm) was carried out, and nickel plating (plating thickness 2.0 μm) was carried out on it to obtain an undercoating layer with a total thickness of about 2 μm. Palladium plating was performed on this bottom plating layer to obtain an intermediate plating layer with a thickness of 0.05 μm. By performing tin plating with a thickness of 3 μm on the obtained intermediate plating layer, a surface plating layer with a thickness of about 3 μm was obtained. In addition, these respective plating steps were carried out by strip plating, PD-LF-800 manufactured by N.E. Chemcat Co., Ltd. was used as a palladium plating solution, and SBS-M manufactured by Yuken Kogyo Co., Ltd. was used as a tin plating solution. I...
Embodiment 2
[0069] Tape 1 obtained in Example 1 was introduced into a simple reflow furnace, and tape 2 was obtained by annealing at a peak temperature of 225° C. for 2 minutes. The cross-sectional observation of the obtained tape 2 was performed by the same method as in Example 1. exist Figure 4 The middle shows the micrograph of the cross-section of the observed part. exist Figure 4 Among them, 41 represents the nickel bottom layer, 42 represents the diffusion layer as an intermediate layer, and 43 represents the tin surface layer.
Embodiment 3
[0071] Tape 1 obtained in Example 1 was introduced into a simple reflow furnace, and tape 3 was obtained by reflowing at a peak temperature of 310° C. for 2 seconds. The cross-sectional observation of the obtained tape 3 was performed by the same method as in Example 1. exist Figure 5 (a) shows a micrograph of the section of the observed site. exist Figure 5 In (a), 51 denotes a nickel underlayer, 52 denotes a tin-palladium diffusion layer as an intermediate layer, and 53 denotes a surface layer. In addition, in the surface layer 53, 54 is a tin phase, and 55 is a tin-palladium alloy phase. In addition, the surface of the tape 3 was observed with an X-ray diffraction device. exist Figure 5 (b) shows the obtained X-ray diffraction pattern. It was confirmed that the equivalent of PdSn 4 peaks exist.
[0072] From Example 2, it was confirmed that the diffusion layer 42 was formed between the surface layer 43 and the bottom layer 41 by performing annealing treatment aft...
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