Wax-free grinding and polishing template with double inlaying layers
A double inlay and inlay layer technology, which is applied in the direction of grinding tools, can solve the problems of high replacement cost, large thickness deviation of silicon wafers, wax pollution, etc., and achieve the effects of improving polishing efficiency, reducing thickness deviation, and reducing production costs
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[0022] In order to further understand the content, characteristics and effects of the present invention, the following embodiments are exemplified and described in detail as follows in conjunction with the accompanying drawings:
[0023] like figure 1 and figure 2 Shown: a double mosaic layer wax-free grinding and polishing template, the upper mosaic layer 2 of the double mosaic layer wax-free grinding and polishing template is provided with at least one chip placement hole 1, figure 1 In, the described sheet hole 1 is a circular hole; figure 2 , the chip placement hole 1 is a rectangular hole; in the actual processing process, the shape of the chip placement hole 1 can be processed and matched according to the shape of the material to be ground and polished; the lower mosaic layer 6 has the same The same technical features of the mosaic layer 2, the double mosaic layer wax-free grinding and polishing template is provided with a guide hole 9 for penetrating the polishing l...
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