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Insulation heat conduction glass fiber reinforced PC/ABS alloy material and preparation method thereof

An insulating and thermally conductive, alloy material technology, applied in the field of alloy materials, can solve the problems of poor thermal conductivity, decrease in impact strength and tensile strength, limiting the application of PC/ABS alloys, etc., to achieve improved thermal conductivity, good insulation and thermal conductivity, expansion Application-wide effects

Active Publication Date: 2012-07-18
HEFEI GENIUS NEW MATERIALS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

But its poor thermal conductivity limits the application of PC / ABS alloy
[0004] Li Li of Shandong University et al. used alumina, silicon carbide, bismuth oxide, etc. as thermal conductive fillers to improve the thermal conductivity of PC / ABS, but its impact strength and tensile strength decreased to a large extent.

Method used

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  • Insulation heat conduction glass fiber reinforced PC/ABS alloy material and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0033] (1) Pretreatment of thermally conductive fillers: add 30 parts of 20-500 micron large particle size thermally conductive filler magnesium oxide and 10 parts of 0.5~5 micron small particle size thermally conductive filler magnesium oxide into the high-speed mixer, and then add 3 parts of NDZ- 201 titanate coupling agent, mix evenly, then put it into an oven, and dry it at 100°C for 3-5 hours to further combine the coupling agent and thermal conductive filler, and set aside;

[0034] (2) Pretreatment of glass fibers: add 10 parts of E-type glass fibers with a fiber diameter of 5 to 24 μm, and 2 parts of NDZ-201 titanate coupling agent into a high-speed mixer and mix evenly, and set aside;

[0035] (3) The pretreatment thermally conductive filler obtained in step (1), 50 parts of bisphenol A polycarbonate PC with a viscosity-average molecular weight of 20000 to 30000 and 50 parts of ABS (wherein the content of butadiene is 30 to 60%) ), join in the high-speed mixer, add 0....

Embodiment 2

[0038] (1) Pretreatment of thermally conductive fillers: add 70 parts of 20 to 500 micron large particle size thermal conductive filler alumina and 20 parts of 0.5 to 5 micron small particle size thermal conductive filler alumina into the high-speed mixer, and then add 3 parts of KH- 560 silane coupling agent, mix evenly, then put it into an oven, and dry it at 100°C for 3-5 hours to further combine the coupling agent and thermal conductive filler, and set aside;

[0039] (2) Pretreatment of glass fibers: add 20 parts of E-type glass fibers with a fiber diameter of 5 to 24 μm, and 2 parts of KH-560 silane coupling agent into a high-speed mixer and mix evenly, and set aside;

[0040] (3) The pretreatment thermally conductive filler obtained in step (1), 70 parts of bisphenol A polycarbonate PC with a viscosity-average molecular weight of 20000 to 30000 and 30 parts of ABS (wherein the content of butadiene is 30 to 60%) ), added to a high-speed mixer, added 0.5 parts of 1010 and...

Embodiment 3

[0043] (1) Pretreatment of thermally conductive fillers: add 120 parts of 20-500 micron large particle size thermally conductive filler silicon carbide and 30 parts of 0.5~5 micron small particle size thermally conductive filler silicon carbide into the high-speed mixer, and then add 3 parts of NDZ- 201 titanate coupling agent, mix evenly, then put it into an oven, and dry it at 100°C for 3-5 hours to further combine the coupling agent and thermal conductive filler, and set aside;

[0044] (2) Pretreatment of glass fibers: add 30 parts of S-type glass fibers with a fiber diameter of 5 to 24 μm, and 2 parts of KH-560 silane coupling agent into a high-speed mixer and mix evenly, and set aside;

[0045] (3) The pretreatment thermally conductive filler obtained in step (1), 90 parts of bisphenol A polycarbonate PC with a viscosity average molecular weight of 20000 to 30000 and 30 parts of ABS (wherein the content of butadiene is 30 to 60%) ), added to a high-speed mixer, added 0.5...

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Abstract

The invention discloses an insulation heat conduction glass fiber reinforced PC / ABS (Poly Carbonate / Acrylonitrile Butadiene Styrene) alloy material and a preparation method thereof, belonging to the technical field of alloy materials. The alloy material disclosed by the invention comprises the following components in parts by weight: 50-90 parts of PC, 10-50 parts of ABS, 30-150 parts of heat conduction material, 10-30 parts of glass fiber, 2-5 parts of coupling agent, 0.1-1 part of antioxygen and 0.3-2 parts of glass fiber rich surface preventing agent. The invention also discloses a preparation method of the alloy material. The insulation heat conduction glass fiber reinforced PC / ABS alloy material keeps excellent physical performance of a PC / ABS alloy material, has excellent insulation heat conduction performance and heat conduction property, is enlarged in the application range in the market, and is especially applied to the electronics.

Description

technical field [0001] The invention belongs to the technical field of alloy materials, and in particular relates to a PC / ABS alloy material reinforced by insulating and heat-conducting glass fibers and a preparation method thereof. Background technique [0002] Most polymer materials are poor conductors of heat, and their thermal conductivity is very small, about 1 / 500 to 1 / 600 of that of metals. In the electronics industry, electronic instruments are becoming lighter, thinner and smaller, while the operating frequency is increasing sharply, and the thermal environment of semiconductors is rapidly changing to high temperature. At this time, the heat generated by electronic equipment is rapidly accumulating and increasing. It can dissipate heat in time to ensure normal operation. In order to meet the heat dissipation requirements of components, it is urgent to develop thermally conductive and insulating polymer materials with high reliability and high heat dissipation perfo...

Claims

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Application Information

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IPC IPC(8): C08L69/00C08L55/02C08K13/06C08K9/04C08K9/06C08K3/22C08K3/28C08K3/34C08K7/14B29C47/92B29C48/92
Inventor 何璟
Owner HEFEI GENIUS NEW MATERIALS
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