Mask plate and preparing method thereof

Abstract

The invention provides a mask plate and a preparing method thereof, wherein the mask plate includes a parent plate, wherein a plurality of arrayed grooves formed in an electroforming way and a electroforming layer surrounding the grooves are arranged on one side of the parent plate; and a plurality of narrow grooves penetrating the parent plate are formed on the parent plate in an etching way, and the narrow grooves are partially or wholly communicated with the grooves. The mask plate not only satisfies requirement of the high opening rate of the mask plate under the condition of high resolution, and can better satisfies the demand of the big-dimension mask plate in strength.

Description

technical field [0001] The invention relates to a mask (Shadow Mask) used in an evaporation process and a preparation method of the mask. Background technique [0002] In the past, cathode ray tube (CRT) equipment was mainly used as a display device, but in recent years, devices such as plasma display panel (PDP) equipment, liquid crystal display (LCD) equipment, and organic light emitting display (Organic Light Emitting Display, Hereinafter referred to as OLED) flat panel display devices have been widely researched and used. [0003] Among these flat panel display devices, OLED devices are different from liquid crystal display (LCD) devices in that they are self-illuminating and do not require additional light sources, so OLED devices have the advantages of thin thickness, light weight, fast response speed, wide viewing angle, and high color saturation. Advantages and has attracted widespread attention, more and more OLEDs are used in display and lighting fields. [0004]...

AI Technical Summary

Problems solved by technology

In this case, relying on the existing process conditions, the mask plate made by the existing etching and electroforming methods cannot meet the high resolution and large size requirements required for screen preparation.

[0006] For masks made by etching, such as figure 1 Shown is a schematic cross-sectional view of an existing mask plate formed by one etching, limited by the etching equipment and process, it is currently impossible to achieve a small and uniform line width, resulting in a mask formed by one etching The uniformity of the opening a and the stability between batches are poor

like figure 2 Shown is a cross-sectional schematic diagram of an existing mask plate that is etched twice, that is, on both sides of the mask plate in the thickness direction. This two-time etching method makes it contact with the glass substrate. It is difficult to control the etching of the surface. If the control is not good, it will affect the evaporation quality and the overall performance of the screen.

Furthermore, for a large-sized mask, in order to enhance its strength, it is considered to be made in the form of grooves, but the distance between the openings of the grooves in this way cannot be made very small (>35um), which cannot meet the requirements of high resolution and high resolution. Aperture Ratio Top Emission Production Requirements

[0007] For high-definition masks produced by electroforming, although the spacing between the grooves can be small, but because the electroforming is very thin, it cannot meet the needs of large-scale strength.

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