Photosensitive resin composition, photosensitive element using same, method for forming resist pattern, method for producing lead frame, printed wiring board, and method for producing printed wiring board

A technology of photosensitive resin and composition, which is applied in the field of photosensitive resin composition, can solve problems such as hard-to-peel light tool workability, light tool pollution, reduction, etc., and achieve the effect of excellent peeling characteristics

Inactive Publication Date: 2012-07-18
HITACHI CHEM CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Usually, the photosensitive resin layer maintains a certain degree of adhesiveness in order to adhere to the base material. If this method is used, problems such as: the phototool and the photosensitive resin layer are tightly bonded, and it is difficult to peel the phototool. Decreased workability, contamination of phototools with photosensitive resin composition, or decreased sensitivity due to the influence of oxygen barrier
However, this method is time-consuming and laborious for coating in order to multilayer the photosensitive resin layer, and has no effect on sensitivity reduction.

Method used

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  • Photosensitive resin composition, photosensitive element using same, method for forming resist pattern, method for producing lead frame, printed wiring board, and method for producing printed wiring board
  • Photosensitive resin composition, photosensitive element using same, method for forming resist pattern, method for producing lead frame, printed wiring board, and method for producing printed wiring board
  • Photosensitive resin composition, photosensitive element using same, method for forming resist pattern, method for producing lead frame, printed wiring board, and method for producing printed wiring board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0243] The following examples illustrate the present invention specifically, but the present invention is not limited by these examples. Here, "parts" and "%" are mass standards unless otherwise stated.

Synthetic example

[0245] (Synthesis of Binder Polymer (A-1))

[0246] 150g of methacrylic acid, 125g of benzyl methacrylate, 25g of methyl methacrylate and 200g of styrene (mass ratio 30 / 25 / 5 / 40) as a polymerizable monomer (monomer), and azobisisobutyl 9.0 g of nitriles were mixed to prepare solution a.

[0247] Solution b was prepared by dissolving 1.2 g of azobisisobutyronitrile in 100 g of a mixed solution (mass ratio 3:2) of 60 g of methyl cellosolve and 40 g of toluene.

[0248] In a flask equipped with a stirrer, a reflux condenser, a thermometer, a dropping funnel, and a nitrogen gas introduction tube, 450 g of a mixed solution (mass ratio 3: 2) of 270 g of methyl cellosolve and 180 g of toluene was dropped, and nitrogen gas was blown into the flask. While stirring, the temperature was raised to 80°C.

[0249] After adding the above-mentioned solution a dropwise to the above-mentioned mixed liquid in the flask over 4 hours, the mixture was kept at 80° C. for 2 hours while stirring. Ne...

Embodiment 1～11 and comparative example 1～4

[0266] [Preparation of Photosensitive Resin Composition]

[0267] A-1 to A-6 obtained above were used as (A) binder polymer, B-1 to B-4 shown below as (B) polymerizable compound, and as (C) photopolymerization initiator C-1A, C-1B, and C-2 shown below of the agent, and the ingredients shown below as other components were mixed according to the compounding amounts (parts to be compounded) shown in the following Table 2, thereby preparing respectively The photosensitive resin composition of Examples 1-11 and Comparative Examples 1-4. Here, the compounding quantity (compounding part) of (A) binder polymer shown in Table 2 is the mass (solid content quantity) of a non-volatile component.

[0268] (B) Photopolymerizable compound

[0269] B-1: 2,2-bis(4-(methacryloyloxypentaethoxy)phenyl)propane [FA-321M (manufactured by Hitachi Chemical Industries, Ltd., product name)]

[0270] B-2: 2,2-bis(4-((meth)acryloyloxydipropoxy)phenyl)propane [BPE-200 (manufactured by Shin-Nakamura Chem...

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Abstract

Disclosed is a photosensitive resin composition which is configured to contain: a binder polymer that has a constituent unit derived from a (meth)acrylic acid and a constituent unit derived from a benzyl (meth)acrylate or a benzyl (meth)acrylate derivative; a polymerizable compound that has at least one ethylenically unsaturated bond; and a photopolymerization initiator that contains an acylphosphine oxide compound and a hexaaryl biimidazole derivative.

Description

technical field [0001] The present invention relates to a photosensitive resin composition, a photosensitive element using the same, a method for producing a resist pattern, a method for producing a lead frame, a printed wiring board, and a method for producing a printed wiring board. Background technique [0002] In the field of production of printed wiring boards, photosensitive resin compositions are widely used as resist materials for etching, plating, etc., and a layer containing the photosensitive resin composition (hereinafter referred to as " photosensitive resin layer") and a photosensitive element (laminate) having a structure in which a protective film is disposed on the photosensitive resin layer. [0003] Conventionally, printed wiring boards have been manufactured using the photosensitive element described above, for example, in the following procedure. That is, first, the photosensitive resin layer of the photosensitive element is laminated on a circuit-formi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/029C08F2/44C08F2/50G03F7/004G03F7/033H05K3/06H05K3/18
CPCC08F220/06G03F7/033H05K3/064H05K3/181G03F7/029C08F2/50C08F220/18C08F220/1807C08F2/44H05K3/06
Inventor 岩下健一栉田昌孝
Owner HITACHI CHEM CO LTD
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