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Liquid adhesive composition for semiconductor, semiconductor device, and method for manufacturing semiconductor device

A technology of semiconductors and compositions, applied in semiconductor/solid-state device manufacturing, semiconductor devices, electric solid-state devices, etc., can solve the problems of wafer warpage, adhesive tape cannot be easily peeled off, etc. Effects of heat energy and volatile organic compounds, excellent heat resistance

Inactive Publication Date: 2012-07-18
HITACHI CHEM CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In addition, heating is required to volatilize the solvent by drying, so when coating a resin paste on a wafer with a peelable adhesive tape, there are problems such as that the adhesive tape cannot be easily peeled off or wafer warpage occurs.

Method used

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  • Liquid adhesive composition for semiconductor, semiconductor device, and method for manufacturing semiconductor device
  • Liquid adhesive composition for semiconductor, semiconductor device, and method for manufacturing semiconductor device
  • Liquid adhesive composition for semiconductor, semiconductor device, and method for manufacturing semiconductor device

Examples

Experimental program
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Effect test

Embodiment

[0302] Hereinafter, examples will be given to describe the present invention more specifically. However, the present invention is not limited to the following examples.

[0303]

[0304] (P-1)

[0305] In a flask equipped with a stirrer, a thermometer, and a nitrogen replacement device, 5.72 g (0.02 mol) of MBAA (manufactured by Wakayama Seika Chemical Co., Ltd., trade name "MBAA", molecular weight: 286), 13.57 g (0.03 mol) of "D -400" (trade name "D-400" (molecular weight: 433), manufactured by BASF), 2.48g (0.01mol) 1,1,3,3-tetramethyl-1,3-bis(3-aminopropyl) ) disiloxane (trade name "BY16-871EG", manufactured by Toray Dow Corning Co., Ltd.) and 8.17 g (0.04 mol) of 1,4-butanediol bis(3-aminopropyl) ether (trade name " B-12", manufactured by Tokyo Chemical Industry Co., Ltd., molecular weight 204.31), and 110 g of NMP as a solvent were stirred to dissolve the diamine in the solvent.

[0306] While cooling the above-mentioned flask in an ice bath, 29.35 g (0.09 mol) of 4,...

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Abstract

Disclosed is a liquid adhesive composition for semiconductor, which contains (A) a radiation polymerizable compound, (B) a photoinitiator and (C) a thermosetting resin. The liquid adhesive composition for semiconductor is characterized in that: the component (B) contains (B1) a compound that has a molecular absorption coefficient of not less than 100 ml / gcm with respect to light having a wavelength of 365 nm; and the solvent content is not more than 5% by mass.

Description

technical field [0001] The present invention relates to a liquid semiconductor adhesive composition, a semiconductor device using the adhesive composition, and a method for producing the same. Background technique [0002] A stacked package type semiconductor device in which a plurality of chips are stacked in multiple stages is used for memory and the like. When manufacturing a semiconductor device, a film-like adhesive is used to bond semiconductor elements to each other or to bond a semiconductor element to a support member for mounting a semiconductor element. In recent years, along with miniaturization and thinning of electronic components, further thinning of the film adhesive for semiconductors has been desired. However, when producing a film-like adhesive having a thickness of 10 μm or less, it is difficult to produce because a uniform film thickness cannot be obtained and pinholes often occur. In addition, since the adhesion and thermocompression bonding propertie...

Claims

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Application Information

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IPC IPC(8): H01L21/52
CPCH01L2924/01015H01L2924/01023H01L2924/01004H01L2224/27418H01L24/32H01L2924/01029H01L2924/01027H01L2224/48091H01L2924/01013H01L2224/8385C08G73/10H01L2224/27416C09J179/08H01L2224/32225H01L2224/92247H01L24/27H01L2924/01084H01L2924/0665H01L2224/274H01L2224/83191H01L2224/2919H01L2924/01047H01L2924/04953H01L2924/01079H01L24/48H01L25/0657H01L2924/0104H01L2224/48227H01L24/83H01L24/29H01L2924/01005H01L2924/01033H01L2224/32145H01L2924/01006H01L2225/0651H01L2924/0102H01L2924/10253H01L2924/01075H01L2924/01012H01L2224/73265H01L2924/07802H01L2924/01051H01L24/73H01L2924/181H01L2924/00014H01L2924/00H01L2924/3512H01L2924/00012H01L2224/45099H01L2224/45015H01L2924/207
Inventor 满仓一行川守崇司增子崇加藤木茂树藤井真二郎
Owner HITACHI CHEM CO LTD
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