Method for improving machining efficiency of micro-channel preparation through femtosecond laser

A technology of femtosecond laser and processing efficiency, which is applied in the field of femtosecond laser application, can solve the problems of low efficiency, reduce the controllability of precision processing, and the processing speed is only 0.3μm/, and achieve the effect of improving the preparation efficiency

Inactive Publication Date: 2012-07-25
BEIJING INSTITUTE OF TECHNOLOGYGY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

In the literature Y.Li, K.Itoh, W.Watanabe, K.Yamada, D.Kuroda, J.Nishii, Y.Jiang: Opt.Lett.26, 23 (2001), the author uses femtosecond laser water-assisted method, processed in a bottom-up manner, and prepared a microchannel with an inlet diameter of ~5 μm and a depth-to-diameter ratio of ~1:50, but the processing speed is only 0.3 μm / s, and the efficiency is low; in the literature D.J.Hwang, T.Y.Choi , C.P.Grigoropoulos.Appl.Phys.A, 79, 605-612(2004), the author used the ultrasonic-assisted method in water to increase the speed of femtosecond laser processing microchannels to 30μm / s, but in the processing system The introduction of ultrasonic vibration will bring uncertain factors to precision machining and reduce the controllability of precision machining

Method used

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  • Method for improving machining efficiency of micro-channel preparation through femtosecond laser
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  • Method for improving machining efficiency of micro-channel preparation through femtosecond laser

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Experimental program
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Effect test

Embodiment 1

[0025] The femtosecond laser system 1 uses a laser produced by Spectrum Physics in the United States. The laser wavelength is 800nm, the pulse width is 50 femtoseconds, the repetition frequency is 1KHz, the maximum energy of a single pulse is 3mJ, and the light intensity distribution is Gaussian and linearly polarized.

[0026] Test sample 9 is K9 glass with a thickness of 1.5 mm.

[0027] A method for improving the processing efficiency of microchannels prepared by femtosecond laser proposed by the present invention, the schematic diagram of the processing optical path is as follows figure 1 As shown, the specific processing steps are as follows:

[0028] Step 1: Use femtosecond laser system 1 to generate femtosecond pulse laser, use the combination of half-wave plate 2 and polarizer 3 to adjust the single pulse energy to 20 μJ, and modulate the traditional femtosecond laser into a pulse sequence through pulse shaper 4, the The sequence contains two sub-pulses with a pulse i...

Embodiment 2

[0034] The femtosecond laser system 1 uses a laser produced by Spectrum Physics in the United States. The laser wavelength is 800nm, the pulse width is 50 femtoseconds, the repetition frequency is 1KHz, the maximum energy of a single pulse is 3mJ, and the light intensity distribution is Gaussian and linearly polarized.

[0035] Test sample 9 is K9 glass with a thickness of 1.5 mm.

[0036] A method for improving the processing efficiency of microchannels prepared by femtosecond laser proposed by the present invention, the schematic diagram of the processing optical path is as follows figure 1 As shown, the specific processing steps are as follows:

[0037] Step 1: Use femtosecond laser system 1 to generate femtosecond pulse laser, use the combination of half-wave plate 2 and polarizer 3 to adjust the single pulse energy to 36 μJ, and modulate the traditional femtosecond laser into a pulse sequence through pulse shaper 4, the The sequence contains two sub-pulses with a pulse i...

Embodiment 3

[0043] The femtosecond laser system 1 uses a laser produced by Spectrum Physics in the United States. The laser wavelength is 800nm, the pulse width is 50 femtoseconds, the repetition frequency is 1KHz, the maximum energy of a single pulse is 3mJ, and the light intensity distribution is Gaussian and linearly polarized.

[0044] Test sample 9 was fused silica and had a thickness of 1.5 mm.

[0045] A method for improving the processing efficiency of microchannels prepared by femtosecond laser proposed by the present invention, the schematic diagram of the processing optical path is as follows figure 1 As shown, the specific processing steps are as follows:

[0046]Step 1: Use femtosecond laser system 1 to generate femtosecond pulse laser, use the combination of half-wave plate 2 and polarizer 3 to adjust the single pulse energy to 30 μJ, and modulate the traditional femtosecond laser into a pulse sequence through pulse shaper 4, the The sequence contains two sub-pulses with a ...

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Abstract

The invention relates to a method for improving the machining efficiency of micro-channel preparation through femtosecond laser, which belongs to the technical field of femtosecond laser application. The method includes the steps: firstly, generating the femtosecond pulse laser by the aid of a femtosecond laser system, adjusting energy by means of combination of a half wave plate and a polarizing film and modulating the femtosecond laser into femtosecond interval pulse sequence by the aid of a pulse shaper; secondly, reflecting the pulse sequence laser obtained in the first step to an objective lens for focusing through a reflector, realizing imaging by the aid of a CCD (charge coupled device) and a lighting source, moving a six-dimensional precision electric control platform and positioning a laser focus on the lower surface of a sample horizontally placed on the six-dimensional precision electric control platform; and thirdly, controlling the six-dimensional precision electric control platform to move along a laser propagation direction by the aid of a computer to machine a micro-channel on the sample. As the femtosecond laser is modulated into the femtosecond interval pulse sequence by the aid of the pulse shaper, the micro-channel preparation efficiency is improved. Moreover, introduction of a vibration source is omitted, so that controllability of precision machining cannot be reduced.

Description

technical field [0001] The invention relates to a method for improving the processing efficiency of microchannels prepared by a femtosecond laser, and belongs to the technical field of femtosecond laser applications. Background technique [0002] Microchannels with large depth-to-diameter ratios are widely used in gas or liquid microfluidic devices, microreactors, electrophoresis, and micro total analysis systems. Due to its mature mass production process, silicon is an ideal matrix material for preparing microchannels. However, in some fields with special requirements for light transmission, silicon is replaced by transparent dielectric materials such as quartz glass, PMMA and other polymers. [0003] Due to its high peak power, femtosecond laser has been widely used in the field of micro / nano processing, and femtosecond laser processing of microchannels with large depth-to-diameter ratio is one of the hot research issues. In the literature Y.Li, K.Itoh, W.Watanabe, K.Yama...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K26/38B23K26/06B23K26/0622B23K26/064B23K26/402
Inventor 姜澜刘鹏军冷妮徐传彩
Owner BEIJING INSTITUTE OF TECHNOLOGYGY
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