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Method for providing a respective flat working layer on each of the two working disks of a double-side processing apparatus

A technology of double-sided processing and working disk, applied in metal processing equipment, grinding/polishing equipment, manufacturing tools, etc., can solve the problems of high consumption of dressing blocks, uneconomical grinding pads, high consumption, etc. Avoiding the effect of service life

Active Publication Date: 2012-07-25
SILTRONIC AG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This makes the method uneconomical (high consumption of expensive grinding pads, high consumption of dressing blocks, excessively long dressing process with long installation interruptions)

Method used

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  • Method for providing a respective flat working layer on each of the two working disks of a double-side processing apparatus
  • Method for providing a respective flat working layer on each of the two working disks of a double-side processing apparatus
  • Method for providing a respective flat working layer on each of the two working disks of a double-side processing apparatus

Examples

Experimental program
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Embodiment

[0131] characterized by figure 1 and 2 The non-uniform work discs shown in are bonded to a 0.5mm thick glass fiber reinforced epoxy resin plate as a quarter circle from a size of 1000×1000mm 2 Cut out the ring segment shape from the flat plate. This is a very suitable plastic for carrying out the method of the invention. Due to the extensive use of GFRP-EP as a standard material in the manufacture of electronic printed circuit boards, the plastic is readily available in large dimensions, good dimensional accuracy and stable quality. The bonding is performed initially with a 50 μm thick unloaded, highly viscous synthetic resin adhesive layer, so that in the event of failure, the applied intermediate layer can be removed again without residue. The adhesive layer was supported by a protective film and bonded under heat and pressure (ironing) to the cut epoxy resin panels. After peeling off the protective film, the GFRP cut-out sheet thus forms in a self-adhesive form and is t...

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PUM

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Abstract

A method provides a respective flat working layer on each of two working disks of a double-side processing apparatus including a ring-shaped upper working disk, a ring shaped lower working disk and a rolling apparatus that are rotatably mounted about an axis of symmetry of the double-side processing apparatus. The method includes applying a lower intermediate layer and upper intermediate layer on respective surfaces of the lower and upper working disks. Then, simultaneous leveling of both intermediate layers is performed by moving trimming apparatuses on cycloidal paths over the intermediate layers using the rolling apparatus and the respective outer toothing under pressure and with addition of a cooling lubricant, so as to provide a material removal from the intermediate layers. A lower working layer of uniform thickness is then applied to the lower intermediate layer and an upper working layer of uniform thickness is applied to the upper intermediate layer.

Description

technical field [0001] The invention relates to a method for providing a flat working layer on each of two working discs of a double-sided processing apparatus comprising an annular upper working disc, an annular lower working disc and a roller arrangement, wherein the The symmetry axis of the double-sided processing equipment is rotatably mounted with the two working disk and roller devices. Background technique [0002] Electronics, microelectronics and microelectromechanics require semiconductor wafers as starting materials to have extremely high overall and local flatness, single-sided flatness (nanotopography), roughness and cleanliness. A semiconductor wafer is a wafer composed of semiconductor materials such as elemental semiconductors (silicon, germanium), compound semiconductors (such as elements of the third main group of the periodic table such as aluminum, gallium or indium and elements of the periodic table Elements of the fifth main group in the group such as ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24B37/08B24B37/24
CPCB24B53/12B24B37/245B24B53/017H01L21/304B24B53/02B24B53/095B24B37/04B24B37/00B24B37/08B24B37/24
Inventor G·皮奇
Owner SILTRONIC AG