Bi-component conductive polyurethane pouring adhesive and preparation method thereof

A polyurethane and potting adhesive technology, which is applied in polyurea/polyurethane adhesives, chemical instruments and methods, adhesives, etc., can solve problems such as poor insulation of potting adhesives, short circuits of components, and non-compliance with environmental protection requirements. Long operating time, high thermal conductivity, and strong bonding effect

Inactive Publication Date: 2012-08-08
HEFEI UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, electronic devices will generate a lot of heat during the working process. If they cannot be dissipated in time, it will lead to short circuit and burnout of the components, which puts forward high requirements on the thermal conductivity of the potting compound.
In addition, most polyurethane encapsulants contain plasticizers, which do not meet the requirements of

Method used

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  • Bi-component conductive polyurethane pouring adhesive and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0030] 1. Component I:

[0031] 40g of polyoxypropylene diol (Mn=1000) was vacuum dehydrated at 120°C for 4h, and after cooling to room temperature, 2g of glycerol, 0.5g of dibutyltin dilaurate, 0.5g of stannous octoate, and 2g of methyl silicone oil were added , 120g KH550 modified alumina, stirred at a high speed for 0.5h on a high-speed mixer to obtain component I;

[0032] 2. Component II:

[0033] The liquefied MDI of weighing 16g is component II;

[0034] When potting, mix component I and component II evenly to obtain potting glue, pour the potting glue on the device to be potted, pre-cure for 10 hours under vacuum and normal temperature, and then cure for 10 hours at 70°C. Can.

Embodiment 2

[0038] 1. Component I:

[0039] 60g of polyoxypropylene trihydric alcohol (Mn=600) was vacuum dehydrated at 120°C for 4 hours, and after cooling to room temperature, 1.5g of 1,3-propanediol, 1g of dibutyltin dilaurate, 2g of methyl silicone oil, and 400g of tetratitanate were added. The alumina modified by butyl ester was stirred at a high speed for 1.5h on a high-speed mixer to obtain component I;

[0040] 2. Component II:

[0041] The isophorone diisocyanate weighing 25g is component II;

[0042] When potting, mix component I and component II evenly to obtain potting glue, pour the potting glue on the device to be potted, pre-cure for 5 hours under vacuum and room temperature, and then cure at 65°C for 10 hours. Can.

Embodiment 3

[0046] 1. Component I:

[0047] 60g of polyoxypropylene diol (Mn=1500) was vacuum dehydrated at 120°C for 4h, and after cooling to room temperature, 2g of trimethylolpropane (TMP), 0.5g of dibutyltin dilaurate, and 1g of stannous octoate were added , 2g of methyl silicone oil, 140g of aluminum nitride modified by tetrabutyl titanate, stirred at high speed on a high-speed mixer for 1h, and obtained component I;

[0048] 2. Component II:

[0049] The isophorone diisocyanate weighing 15g is component II;

[0050] When potting, mix component I and component II evenly to obtain potting glue, pour the potting glue on the device to be potted, pre-cure for 7 hours under vacuum and normal temperature, and then cure for 5 hours at 80°C. Can.

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Abstract

The invention discloses a bi-component conductive polyurethane pouring adhesive and a preparation method thereof, wherein a component I is obtained by evenly mixing polymer polyol, chain extenders, catalytic agents, antifoaming agents and modified thermal fillers, and a component II is isocyanate. When in specific use, the two components are evenly mixed and solidified after pouring. The pouring adhesive is free of solvent, environment-friendly, moderate in viscosity and capable of being solidified at the normal temperature or rising temperature, and has the advantages of being good in insulation, flexibility, adhesion and low-temperature performance, capable of being used in a wide temperature range and the like, and has the conductive factor as high as 1.5W/m*K.

Description

1. Technical field [0001] The invention relates to a potting glue and a preparation method thereof, in particular to a two-component heat-conducting polyurethane potting glue and a preparation method thereof. 2. Background technology [0002] As we all know, with the development of science and technology, there are more and more types of electronic components, and the connection of circuits tends to be finer and denser. Therefore, great requirements are placed on the stability of each component of electronic devices. In order to prevent moisture, dust, etc. from entering the electronic device and make the electronic device more stable, the electronic device needs to be potted. Potting can avoid the direct exposure of electronic devices to the air, block the direct contact of electronic devices with water and acid-base substances in the air, and at the same time combine electronic devices together to ensure the integrity of electronic devices and improve the stability of elec...

Claims

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Application Information

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IPC IPC(8): C09J175/14C09J11/04C08G18/67C09K3/10
Inventor 徐卫兵安佳丽王洁玲吕洪香周正发任凤梅
Owner HEFEI UNIV OF TECH
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