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Silvering powder conductive adhesive for LED packaging and production method thereof

A technology of LED packaging and conductive adhesive, which is applied in the direction of conductive adhesives, circuits, adhesives, etc., can solve the problems of unobvious cost control and rising proportion of cost, and achieve stable electrical conductivity, simple preparation, and stable thermal conductivity. Effect

Inactive Publication Date: 2012-08-15
YANTAI DARBOND TECH
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  • Summary
  • Abstract
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  • Application Information

AI Technical Summary

Problems solved by technology

However, with the increasing demand for silver and other precious metals in the industry, the price of silver powder has been rising, resulting in a significant increase in the cost of traditional conductive adhesives in the LED chip packaging process.
Although some new conductive adhesive products have appeared in China, silver powder is basically used as a filler, and cost control is not obvious

Method used

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  • Silvering powder conductive adhesive for LED packaging and production method thereof
  • Silvering powder conductive adhesive for LED packaging and production method thereof
  • Silvering powder conductive adhesive for LED packaging and production method thereof

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Embodiment Construction

[0022] The principles and features of the present invention are described below, and the examples given are only used to explain the present invention, and are not intended to limit the scope of the present invention.

[0023] Then follow the steps below to prepare silver-plated powder conductive adhesive:

[0024] 1) Mix epoxy resin and epoxy diluent at room temperature for 10 minutes;

[0025] Wherein, the epoxy resin accounts for 4-12% of the total weight of the formula, and the epoxy diluent accounts for 3-10% of the total weight of the formula;

[0026] 2) Add additives to the mixture prepared in step 1), and mix at room temperature for 10 minutes;

[0027] Wherein, the additives include a curing agent accounting for 2-3% of the total weight of the formula, a curing accelerator and a coupling agent accounting for 0.5-2% of the total weight of the formula.

[0028] 3) Grinding the mixture prepared in step 2) on a three-roll mill at room temperature to become a fine and u...

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Abstract

The invention relates to silvering powder conductive adhesive for LED packaging and a production method thereof. The silvering powder conductive adhesive for LED packaging comprises, in weight percentage, 75-90% of silvering powder, 4-12% of epoxy resin, 3-10% of epoxy thinner, and 3-7% of additive. The production method includes: firstly, mixing the epoxy resin and the epoxy thinner at room temperature for 3-30 minutes; secondly, adding the additive in the mixture obtained in the step 1, and mixing at the room temperature for 3-30 minutes; thirdly, adding the slivering powder in the mixture obtained in the step 2, and vacuum-mixing at the room temperature to obtain the silvering powder conductive adhesive. The silvering powder conductive adhesive is simple in preparation and low in cost, and has fine and stable electric conductivity and thermal conductivity.

Description

technical field [0001] The invention relates to a silver-plated powder conductive adhesive and a preparation method thereof, in particular to a silver-plated powder conductive adhesive used for LED packaging and a preparation method thereof. Background technique [0002] Compared with traditional light sources, LED lighting has obvious advantages such as small size, energy saving, environmental protection, and durability, and has been rapidly promoted and widely used in recent years. LED lighting is the future development trend of indoor lighting, landscape lighting, vehicle lighting and other fields. [0003] LED chip packaging technology is one of the core technologies of LED device manufacturing. In the LED chip packaging process, conductive adhesive is generally used to bond the chip and the base material to fix the chip, and realize the functions of conductive connection and heat dissipation. Most of the traditional conductive adhesives use silver powder as the conduc...

Claims

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Application Information

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IPC IPC(8): C09J163/00C09J9/02H01L33/62
Inventor 吴光勇王建斌陈田安
Owner YANTAI DARBOND TECH
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