Titanium-copper for electronic component

A technology for electronic components and copper alloys, applied in electrical components, circuits, conductive materials, etc., can solve the problems of damaged bending workability, poor bending workability, and inability to obtain strength, and achieve excellent bending workability and improved strength. , the effect of suppressing rapid coarsening

Active Publication Date: 2015-01-14
JX NIPPON MINING & METALS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The problem that arises at this time is that strength and bendability have opposite characteristics.
That is, if the strength is increased, the bending workability is impaired, and conversely, if the bending workability is emphasized, the required strength cannot be obtained
Generally, the more the reduction rate of cold rolling is increased, the amount of dislocations introduced will increase, and the dislocation density will increase. Therefore, increasing the nucleation sites that contribute to precipitation can increase the strength after aging treatment. However, if the reduction rate is excessively increased, the Poor bending workability

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0078] Examples of the present invention are shown below together with comparative examples. These examples are provided for better understanding of the present invention and its advantages, and are not intended to limit the invention.

[0079] When producing the copper alloy of the example of the present invention, active metal Ti is added as the second component, so a vacuum melting furnace is used for melting. In addition, the mixing of impurity elements other than the elements specified in the present invention may lead to unexpected side effects. In order to prevent problems, raw materials must be strictly selected for use with higher purity materials.

[0080] First, according to the composition shown in Table 1, add Mn, Fe, Mg, Co, Ni, Cr, V, Nb, Mo, Zr, Si, B and P to Cu respectively, and then add Ti with the composition shown in the table . The holding time after the addition should be fully considered so that there is no molten residue of the added elements, and the...

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Abstract

Provided is titanium-copper which has excellent strength and bendability. The titanium-copper is a copper alloy for electronic components which contains 2.0-4.0 mass% Ti, the remainder comprising copper and incidental impurities. The intensity peak of X-ray diffraction from the {220} crystal plane in a rolled surface of the copper alloy has a half-value width ß{220} which satisfies the relationship 3.0=ß{220} / ß0{220}=6.0, wherein ß0{220} is the half-value width of the intensity peak of X-ray diffraction from the {220} crystal plane of a standard powder of pure copper. The copper alloy, in a structure examination of a section parallel to the rolling direction, has an average crystal-grain diameter of 30 µm or smaller in terms of equivalent-circle diameter.

Description

technical field [0001] The present invention relates to titanium copper suitable as members for electronic components such as connectors and a method for producing the same. Background technique [0002] In recent years, the miniaturization of electronic devices such as mobile terminals has progressed, and therefore, there is a significant tendency for connectors used therein to be required to be narrower in pitch and thinner. The smaller the connector, the narrower the pin width and the smaller folded processing shape is required. Therefore, the members used are required to have high strength to obtain the necessary elasticity and have excellent bending resistance to severe bending processing. Processability. In this regard, copper alloys containing titanium (hereinafter referred to as "titanium copper") have relatively high strength and are the most excellent among copper alloys in terms of stress relaxation characteristics. Therefore, they have been used as signal termin...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C22C9/00C22F1/08H01B13/00C22F1/00C22F1/02
CPCC22C9/00H01B1/026C22F1/08C22F1/02H01B13/00
Inventor 江良尚彦堀江弘泰
Owner JX NIPPON MINING & METALS CORP
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