Atomizing jet device for cleaning

Abstract

The invention relates to the technical field of semiconductor chips, in particular to an atomizing jet device for cleaning, which comprises an upper casing and a lower casing connected with the upper casing. The upper casing is in the shape of a two-step cylinder including a first-step casing and a second-step casing, the cross section area of the first-step casing is smaller than that of the second-step casing, the first-step casing is provided with a cable joint capable of being connected with a power amplifier, and an energy transducer is arranged in the second-step casing. Vent holes are arranged on two side walls of the lower casing, an atomizing jet through hole is arranged at the center of the lower casing, and the vent holes are communicated with the atomizing jet through hole and form included angles with the same. The atomizing jet device for cleaning is simple in structure and high in integration degree, is capable of jetting ultra-micro-atomized liquid drops effectively and effectively cleaning the chips on the premise of protecting surface patterns of the chips while saving water resources to the utmost extent.

Description

technical field [0001] The invention relates to the technical field of semiconductor wafer technology, in particular to a cleaning atomization injection device. Background technique [0002] There are hundreds of cleaning processes in the manufacturing process of integrated circuits. In order to ensure the cleanliness of the surface of the wafer material, the cleaning process accounts for 30% of the entire manufacturing process. Wherein, the wafer refers to a silicon wafer with a pure silicon substrate and a silicon wafer with a copper interconnection structure. According to statistics, each silicon substrate chip with a diameter of 200 mm needs to consume 5 tons of high-purity deionized water in the entire manufacturing process, plus the cost of other various consumables in cleaning, it will be a very high figure. [0003] Further statistics show that more than 50% of the losses in the manufacturing of semiconductor devices are caused by surface contamination and incomplet...

AI Technical Summary

Problems solved by technology

[0007] The technical problem to be solved by the present invention is to provide a cleaning atomization injection device with a simple structure that can spray ultra-fine atomized droplets, so as to overcome the simple atomization mechanism to generate large-size droplets or jet streams, and to 65 nanometers and The chip surface pattern of the following process causes serious damage, low utilization rate of cleaning solution and deionized water, etc.

Images