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Process for preparing curing agent for high-power light-emitting diode (LED) packaging material

A technology of LED packaging and preparation process, which is applied in the direction of electrical components, circuits, semiconductor devices, etc., can solve the problems of slow curing reaction, performance degradation of cured products, high curing temperature, etc., and achieve synergistic optimization, accelerated reaction speed, and primary amine content. high effect

Inactive Publication Date: 2012-09-19
唐来江
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Therefore, it cannot fundamentally solve the problems of serious light decay of phosphors during use
There are also many problems in the light stability of transparent epoxy resins for LEDs: the traditional method is to use nano-inorganic materials for modification, the compatibility of nanoparticles and polymer matrix is ​​poor, and nanoparticles are in polymers. Dispersion is also very difficult to achieve
The curing reaction of the acid anhydride curing agent is slow, and the heat distortion temperature is high, but the curing temperature required by the acid anhydride curing agent is relatively high, and the curing cycle is relatively long; it is not easy to modify; it is easy to absorb moisture to form free acid during storage, causing defects. Influence (curing speed is slow, the performance of the cured product is reduced), the alkali resistance and solvent resistance of the cured product are relatively poor
[0007] Therefore, there are some unavoidable problems in the performance of a single anhydride curing agent.
However, modification of a single acid anhydride curing agent may improve its performance, but it may also have certain instability on the basis of increased cost.

Method used

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  • Process for preparing curing agent for high-power light-emitting diode (LED) packaging material
  • Process for preparing curing agent for high-power light-emitting diode (LED) packaging material

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Embodiment Construction

[0016] The present invention will be further described below in conjunction with accompanying drawing and specific embodiment:

[0017] As shown in the accompanying drawings: a preparation process for a curing agent for high-power LED packaging materials, comprising the following steps:

[0018] 1) Mix the amino-terminated polyether curing agent and isophorone diamine to obtain a mixed solution;

[0019] Add o-hydroxybenzophenones, benzotriazole ultraviolet absorbers, hindered amine light stabilizers and nano SiO2 to the above mixed solution for synergistic reaction to obtain the desired curing agent.

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Abstract

The invention discloses a process for preparing a curing agent for a high-power light-emitting diode (LED) packaging material. The process comprises the following steps of: mixing amino-terminated polyether curing agents and isophorone diamine to obtain a mixed solution; and adding ortho-hydroxybenzophenone and benzotriazole ultraviolet absorbing agents, hindered amine light stabilizers and nano-SiO2 into the mixed solution for synergistic reaction to obtain the required curing agent. The amino-terminated polyether curing agents used in the process have the advantages of colorlessness, transparency, low viscosity, low vapor pressure, high content of primary amine and the like, but the reaction time is relatively long; and the curing agent, namely the isophorone diamine is added into the amino-terminated polyether curing agents in order to accelerate reaction speed and not reduce the performance of a cured object, and then a flexible chain segment of the isophorone diamine can be bonded into a compact epoxy resin cross-linking network, so that the toughness of epoxy resin can be well improved, and a curing product cannot crack easily.

Description

technical field [0001] The invention relates to a preparation method of an illumination packaging material, in particular to a preparation process of a curing agent for a high-power LED packaging material. Background technique [0002] With the promotion of semiconductor energy-saving and environmental protection lighting projects, the demand for high-brightness LED devices in the general lighting market is huge. Replacing traditional lighting sources such as incandescent lamps and fluorescent lamps with LED solid-state lamps has become the future development goal of this century. Therefore, the research on the most important packaging material in the LED industry has also become the focus of research at home and abroad. [0003] Both at home and abroad are scrambling to carry out research work on LED lighting. However, in the field of LED packaging materials for white light lighting, although foreign research work has made progress, large-scale industrialization has not y...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G59/56C08K13/02C08K3/36C08L63/00H01L33/56
Inventor 唐来江
Owner 唐来江
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