Process for preparing curing agent for high-power light-emitting diode (LED) packaging material
A technology of LED packaging and preparation process, which is applied in the direction of electrical components, circuits, semiconductor devices, etc., can solve the problems of slow curing reaction, performance degradation of cured products, high curing temperature, etc., and achieve synergistic optimization, accelerated reaction speed, and primary amine content. high effect
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[0016] The present invention will be further described below in conjunction with accompanying drawing and specific embodiment:
[0017] As shown in the accompanying drawings: a preparation process for a curing agent for high-power LED packaging materials, comprising the following steps:
[0018] 1) Mix the amino-terminated polyether curing agent and isophorone diamine to obtain a mixed solution;
[0019] Add o-hydroxybenzophenones, benzotriazole ultraviolet absorbers, hindered amine light stabilizers and nano SiO2 to the above mixed solution for synergistic reaction to obtain the desired curing agent.
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