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A die-bonding film and acrylic technology, which can be applied in the direction of film/sheet without carrier, film/sheet-shaped adhesive, thin material processing, etc., and can solve the problem that the slurry adhesive layer is difficult to homogenize, etc.
Active Publication Date: 2012-09-19
NITTO DENKO CORP
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Problems solved by technology
However, in this method, it is difficult to homogenize the slurry adhesive layer, and the application of the slurry adhesive requires special equipment and a long time.
Method used
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Embodiment 1
[0152] The glycidyl group-containing acrylic copolymer (a) mainly composed of acrylonitrile-ethyl acrylate-butyl acrylate had an epoxy value of 0.18, a glass transition point (Tg) of 30°C, and a weight-average molecular weight of 100 parts of 1.1 million acrylate polymer (manufactured by Negami Industry Co., Ltd., glycidyl acrylate 1.9 mol%) and 17.5 parts of phenolic resin (manufactured by Meiwa Chemical Industry Co., Ltd., "MEH7851") as the phenolic resin (b) were dissolved in In methyl ethyl ketone, an adhesive composition having a concentration of 23.6% by weight was prepared.
[0153] This adhesive composition was coated on a release-treated film as a release liner composed of a polyethylene terephthalate film having a thickness of 50 μm after a silicone release treatment, and then dried at 130° C. for 2 minute. Thus, a die-bonding film having a thickness of 25 μm was produced.
Embodiment 2
[0155] The glycidyl group-containing acrylic copolymer (a) mainly composed of acrylonitrile-ethyl acrylate-butyl acrylate had an epoxy value of 0.22, a glass transition point (Tg) of 15°C, and a weight-average molecular weight of 100 parts of 800,000 acrylate polymer (manufactured by Negami Industry Co., Ltd., glycidyl acrylate 2.3 mol%) and 12.5 parts of phenolic resin (manufactured by Meiwa Chemical Industry Co., Ltd., "MEH7851") as the phenolic resin (b) were dissolved in In methyl ethyl ketone, 40 parts of spherical silica (manufactured by Admatex Co., Ltd., "SO-25R") with an average particle diameter of 500 nm was dispersed therein to prepare an adhesive composition having a concentration of 23.6% by weight. Except for this, it carried out similarly to Example 1, and produced the die-bonding film.
Embodiment 3
[0157] The glycidyl group-containing acrylic copolymer (a) mainly composed of acrylonitrile-ethyl acrylate-butyl acrylate had an epoxy value of 0.42, a glass transition point (Tg) of 15°C, and a weight-average molecular weight of 100 parts of 800,000 acrylate polymer (manufactured by Negami Industry Co., Ltd., glycidyl acrylate 4.5 mol%) and 6.5 parts of phenolic resin (manufactured by Meiwa Chemical Industry Co., Ltd., "MEH7851") as the phenolic resin (b) were dissolved in In methyl ethyl ketone, 40 parts of spherical silica (manufactured by Admatex Co., Ltd., "SO-25R") with an average particle diameter of 500 nm was dispersed therein to prepare an adhesive composition having a concentration of 23.6% by weight. Except for this, it carried out similarly to Example 1, and produced the die-bonding film.
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Abstract
The invention relates to a die-bonding film and the use thereof. The object of the invention is to provide a die-bonding film having a high reliability is provided by which a sufficient adhering strength and an elastic modulus at a high temperature can be obtained before and after curing; the workability is good; air bubbles (voids) do not stay at the boundary between the die-bonding film and the adherend; and the die-bonding film can withstand a humidity resistance solder reflow test. A die-bonding film contains a glycidyl-group-containing acrylic copolymer (a) having a weight-average molecular weight of 500,000 or more and a phenolic resin (b), wherein the weight ratio (x / y) of the content x of the glycidyl-group-containing acrylic copolymer (a) to the content y of the phenolic resin (b) is 5 or more and 30 or less, and the die-bonding film substantially does not contain an epoxy resin having a weight-average molecular weight of 5000 or less.
Description
technical field [0001] The present invention relates to a die-bonding film used when, for example, bonding a semiconductor element such as a semiconductor chip to an adherend such as a substrate or a lead frame. Also, the present invention relates to a dicing / die-bonding film in which the die-bonding film is laminated on a dicing film, and a method of manufacturing a semiconductor device using the same. Background technique [0002] Conventionally, in the manufacturing process of a semiconductor device, silver paste has been used to fix a semiconductor chip on a lead frame or an electrode member. The fixing process is performed by applying a paste-like adhesive on a die pad of a lead frame, etc., mounting a semiconductor chip thereon, and curing the paste-like adhesive layer. [0003] However, the slurry adhesive has large variations in coating amount, coating shape, etc. due to its viscosity behavior, deterioration, and the like. As a result, the thickness of the paste-li...
Claims
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Application Information
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