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High-strength and high-modulus thermosetting resin composition

A technology of resin composition and high modulus, which is applied in the field of thermosetting resin composition, can solve the problems of increased material cost and decreased material toughness, and achieve the effect of increasing elastic modulus and accelerating curing reaction

Inactive Publication Date: 2012-10-03
TONGJI UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Generally, the modulus of thermosetting resin materials can be increased by introducing high rigid groups such as aromatic rings or aromatic heterocycles into the chemical structure of the monomer, or by adding inorganic fillers to the resin, but these methods may increase the strength of the material. cost, or will reduce the toughness of the material

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0023] Weigh 25g epoxy E-44, 17.5g bisphenol A cyanate (BADCy), 5.5g 4,4'-diphenylmethane bismaleimide, 6g 2,2'-(1,3- Phenylene)-bisoxazoline in a beaker, heated to 80°C to melt evenly, then added 2.5g tetraglycidyl-4,4'-diaminodiphenyl ether (4,4'-TGDDE), After stirring evenly, it was degassed in a vacuum oven at 80°C for 15 minutes, then poured into a mold coated with a silicone ester release agent, and cured in an electronic oven. The curing process can be carried out at 150°C / 1h + 180°C / 1h + 200°C / 2h, and the post-curing condition is 240°C / 3h to obtain a dark brown-red solid resin. The bending strength is 144.6MPa, and the bending modulus is 5.23GPa.

Embodiment 2

[0025] Weigh 25g bisphenol A type epoxy E-51, 20g bisphenol A type cyanate (BADCy), 13g 4,4'-diphenylmethane bismaleimide, 4g 2,2'-(1, 3-phenylene)-bisoxazoline, 6g4,4'-diaminodiphenylmethane epoxy resin, and the rest are the same as in Example 1.

[0026] The cured resin had a flexural strength of 150.1 MPa and a flexural modulus of 5.33 GPa.

Embodiment 3

[0028] Weigh 8g o-cresol novolac epoxy, 12g bisphenol A type epoxy E-51, 18g bisphenol A type cyanate (BADCy), 12g 4,4'-diphenylmethane bismaleimide, 6g 2 , 2'-(1,3-phenylene)-bisoxazoline, 5 g tetraglycidyl-4,4'-diaminodiphenyl ether (4,4'-TGDDE), the rest and Example 1 same.

[0029] The cured resin had a flexural strength of 160.5 MPa and a flexural modulus of 5.57 GPa.

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PUM

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Abstract

The invention relates to a high-strength and high-modulus thermosetting resin composition, which is characterized in that the raw materials of the resin is a mixture of component A and component B. The raw materials of component A consist of cyanate ester monomer, bismaleimide monomer, bifunctional epoxy compound and bisoxazoline compound. The component B is glycidyl amine epoxy compound of trifunctional degree or tetrafunctional degree, wherein the glycidyl amine epoxy compound of trifunctional degree or tetrafunctional degree is carried out curing reaction with other components as a crosslinking agent to obtain the high-strength and high-modulus thermosetting resin composition.

Description

technical field [0001] The present invention relates to a thermosetting resin composition having high strength and high modulus. Background technique [0002] Cyanate esters are a class of thermosetting resins with excellent dielectric properties, mechanical properties, heat resistance, and low water absorption. They have broad application prospects in the fields of high-performance circuit boards, wave-transparent structural materials, and high-toughness structural materials. Combining cyanate esters with other compounds in a specific ratio for chemical modification can obtain thermosetting resin materials that meet the needs of different application fields. [0003] In the previous research, the inventor proposed a "high toughness cyanate ester co-curing resin and its preparation method and application (ZL 200910052209.1)". This co-curing modified resin is composed of cyanate ester, bismaleimide, epoxy resin and bisoxazoline compound. Through the co-curing reaction betwee...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G59/50C08G73/06C08G73/12
Inventor 李文峰
Owner TONGJI UNIV
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