High-heat-conduction halogen-free expansion flame-retardant epoxy resin pouring sealant and preparation method thereof

Abstract

The invention relates to the technical field of flame retardant modification, and provides a high-heat-conduction halogen-free expansion flame-retardant epoxy resin pouring sealant and a preparation method thereof. The preparation method comprises the following steps: preparing a first epoxy component, namely mixing epoxy resin, a toughening agent, an epoxy active diluent, a dispersing anti-settling agent and a defoaming agent for forming a first mixture, mixing zinc oxide and boron nitride to obtain a high-heat-conduction filler component, adding the high-heat-conduction filler component intothe first mixture for forming a second mixture, preparing a halogen-free expansion flame-retardant filler component by using crystalline II type diammonium polyphosphate and dipentaerythritol, addingthe halogen-free expansion flame-retardant filler component into the second mixture, and carrying out mixing and defoaming to obtain a first epoxy component; preparing a second epoxy component, namely mixing methyl tetrahydrophthalic anhydride, methyl hexahydrophthalic anhydride, a curing accelerator and a defoaming agent, and then carrying out defoaming to obtain a second epoxy component; and mixing the first epoxy component and the second epoxy component, carrying out defoaming, and then carrying out curing twice. The preparation method has simple operation and low production cost, and theprepared epoxy resin pouring sealant has excellent thermal conductivity and flame retardance.

Description

technical field [0001] The invention belongs to the technical field of flame retardant modification, and in particular relates to a high thermal conductivity halogen-free expansion flame retardant epoxy resin potting compound and a preparation method thereof. Background technique [0002] With the development of microelectronics and large-scale integrated circuits, circuit components are highly concentrated. Epoxy resins are widely used in the field of electronic packaging due to their excellent electrical insulation properties, sealing, transparency and manufacturability. Electronic components potted with epoxy resin can maintain good integrity and dimensional stability, effectively prolonging the service life of electronic chips by 2-3 times; the continuous development of information technology makes electronic components tend to be miniaturized and dense. This makes the heat production per unit area of ​​electronic products increase rapidly. If the heat cannot be effectiv...

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Problems solved by technology

Electronic components potted with epoxy resin can maintain good integrity and dimensional stability, effectively prolonging the service life of electronic chips by 2-3 times; the continuous development of information technology makes electronic components tend to be miniaturized and dense. The heat production per unit area of ​​electronic products increases rapidly. If the heat cannot be effectively conducted in time, it will lead to an increase in the operating temperature of the circuit, which will affect the service life of the electronic equipment. In severe cases, a fire may occur. Therefore, the current epoxy resin potting adhesive Not only requires good heat dissipation, but also good flame retardancy

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