High-frequency copper-clad plate composition applied to antenna base material

Abstract

The invention discloses a high-frequency copper-clad plate composition applied to an antenna base material. The high-frequency copper-clad plate composition contains the following raw materials in parts by weight: 25-50 parts of an organic polymer, 30-65 parts of an inorganic filler, 5-10 parts of a crosslinking agent, 3-10 parts of a curing agent and 2-5 parts of a coupling agent. A copper-clad plate base material prepared from the high-frequency copper-clad plate composition has the advantages of low dielectric constant and dielectric loss, good heat resistance, low thermal expansion coefficient, low water absorption rate and the like and can meet the requirements of a communication antenna to printed circuit board base materials.

Description

technical field [0001] The invention belongs to the technical field of copper-clad laminates, and relates to a high-frequency copper-clad laminate composition applied to communication antenna base materials. Background technique [0002] The advancement of modern information technology has brought digital circuits into the stage of high-speed information processing and high-frequency signal transmission, which puts forward higher requirements for the dielectric constant and dielectric loss of microwave dielectric circuit substrates. Especially for radio communication, the antenna is an important front-end transmitting and receiving device, and the difference in materials used will directly affect the quality of communication. Many of these patents have mentioned that polyphenylene ether and polytetrafluoroethylene can be used as high-frequency circuit boards The material of the substrate. [0003] Polyphenylene ether resin is suitable for circuit board materials in high-fre...

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Problems solved by technology

[0003] Polyphenylene ether resin is suitable for circuit board materials in high-frequency equipment, because polyphenylene ether resin has good high-frequency characteristics, such as low dielectric constant, low dielectric loss, etc., but one disadvantage of polyphenylene ether resin is its It has high melting property, which causes processing defects such as pores during the processing of circuit boards, resulting in unreliable quality of circuit boards

Modified polyphenylene ether can solve the above difficulties well, but the molecular weight distribution of modified polyphenylene ether is not easy to control. If the molecular weight of modified polyphenylene ether is too large, the consistency of the obtained circuit substrate is poor. If the molecular weight is too small, the obtained circuit substrate is heat-resistant. Poor performance, and the moisture resistance and expansion coefficient of the substrate do not meet the requirements at all, so it cannot be applied to communication antenna substrates that require low expansion coefficient and low water absorption.

[0004] PTFE has the best dielectric constant and dielectric loss factor, but the molding lamination temperature required to make copper clad laminates needs to be above 350°C, which requires high equipment requirements, and due to the repellency of PTFE materials Water-based and its low polarity, the hole metallization of printed boards is different from conventional printed boards, and it is very difficult to metallize and plate holes on it

For the hole metallization of PTFE high-frequency printed circuit boards, it is necessary to use highly oxidizing and corrosive solutions such as tetrahydrofuran, strong acid and strong alkali, etc. for pre-activation treatment before electroless copper deposition. There are complex processes, Unfavorable factors such as bad smell and serious environmental pollution

At the same time, polytetrafluoroethylene is a thermoplastic resin. As the temperature changes, the size of the expansion and contraction is very obvious. For the communication antenna, it needs to experience the alternating changes of cold and heat in the day and day, which will cause great damage to the components on the substrate. Therefore, PTFE is also not suitable for communication antenna substrates

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