Cu-Ni-Si-based alloy and preparation method thereof

A cu-ni-si, based alloy technology, applied in the field of Cu-Ni-Si based alloy and its preparation, can solve the problems of not being obtained, and achieve the effects of reasonable alloy composition, simple production process and low production cost

Inactive Publication Date: 2012-10-03
TAIYUAN UNIV OF TECH
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, the Cu-Ni-Si system that has ideal performance indicators and can be applied in actual production (conductivity 60%IACS, hardness value 200Hv) has not yet been obtained.

Method used

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  • Cu-Ni-Si-based alloy and preparation method thereof
  • Cu-Ni-Si-based alloy and preparation method thereof
  • Cu-Ni-Si-based alloy and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment approach 1

[0020] High-strength and high-conductivity Cu-Ni-Si-based alloy, including Cu, Ni, Si, V, its proportion (mass percentage) is: Ni: 2.8%, Si: 0.7%, V: 0.1%, and the rest is Cu.

[0021] Step 1, blank preparation: Pure copper, pure silicon, pure nickel, and pure vanadium with a purity greater than 99.9% are prepared according to the following mass percentages: Cu 95.5~97.5%, Ni 2.0~3.0%, Si 0.5~1.2%, V 0~ 0.3% is smelted in a vacuum induction furnace. After all the raw materials are smelted, they are kept at 1250 ℃ for 20 minutes to ensure that all alloy elements are dissolved and fully diffused, and cast in a metal mold to obtain a length of 190mm, a width of 55mm, and a height of 30mm rectangular blank;

[0022] Step 2, deformation treatment: the billet is first subjected to homogenization annealing treatment at 980oC for 2 hours. The billets were then hot rolled at 980oC with a total deformation of 70%. After the hot-rolled alloy is descaled, it is cold-rolled at room tempe...

Embodiment approach 2

[0025] The difference from Embodiment 1 is that the percentage of V in the alloy composition ratio is increased to 0.2%. Others are the same as process 1. The specific composition ratio and mechanical properties of the alloy are shown in Table 1. After testing, the alloy has the best overall performance: the electrical conductivity is 50%IACS, and the hardness is 200Hv. The average grain size is 10 μm.

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Abstract

The invention belongs to the technical field of copper alloy material, and discloses Cu-Ni-Si-based alloy with high strength and high conductivity, and a preparation method thereof. The Cu-Ni-Si-based alloy is characterized in that the Cu-Ni-Si-V alloy comprises the following components in weight percent: 95.5-97.5% of Cu, 2.0-3.0% of Ni, 0.5-1.2% of Si, and 0-0.3% of V; and the method comprises specific steps as follows: smelting pure copper, pure silicon, pure nickel and pure vanadium in an induction furnace according to the proportion, casting in a metal die to obtain a blank, and performing ageing and solution treatment for the blank after hot rolling and cold rolling deformation treatment. As shown by experimental results, the added alloy V has the remarkable grain refinement function on the CU-Ni-Si alloy; and appropriately-added V (0.086 weight percent) can significantly improve the conductivity of the alloy, at the same time, the combination properties of the alloy are improved to the conductivity of 60% IACS and the hardness number of 205 Hv from the conductivity of 41.4% IACS and the hardness number of 195.7 Hv only with slight reduction in hardness; and the alloy with 0.086 weight percent V can separate out second phase with a volume fraction twice of that of the alloy before adding V.

Description

technical field [0001] The invention discloses a high-strength and high-conductivity Cu-Ni-Si-based alloy and a preparation method thereof, which belong to the technical field of copper alloy materials, and specifically relate to a method of improving the aging power of the alloy by adding low-cost alloy elements, and aging in a short time A high volume fraction of dispersed fine second phase is obtained to achieve the purpose of precipitation strengthening and purification of the matrix, and combined with fine grain strengthening to obtain a Cu-Ni-Si alloy with high strength and high conductivity. Background technique [0002] Copper alloys are widely used as integrated circuit lead frame materials because of their excellent electrical conductivity, low price and good processability. By the 1990s, the consumption of copper-based lead frame materials had accounted for more than 80% of the total consumption of lead frame materials. With the development of integrated circuits...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C22C9/06C22C1/02C22F1/08
Inventor 阙仲萍程伟丽陈津张金山林万明梁伟丁敏
Owner TAIYUAN UNIV OF TECH
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