Agent for treatment of metal surface
A surface treatment agent, metal technology, applied in the direction of electrical components, circuits, semiconductor devices, etc., can solve the problems of not developing effective technology, the influence of silver film light reflectivity, the reduction of light reflection performance, etc., to achieve the characteristics of metal wire welding Excellent effect, good solder wettability, and excellent safety
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Embodiment 1
[0073] As the substrate to be treated, use a pure copper substrate plated with a 4μm thick silver layer, soak it in the surface treatment agent of the following composition at 40°C for 30 seconds, then wash it with water, and dry it with warm air with a blower. for surface treatment.
[0074] Composition of surface treatment agent
[0075] Inhibitor: Triazine-2,4,6-trithiol 0.01% by weight
[0076] Surfactant: oleyl alcohol ethoxylate 0.01% by weight
[0077] Dissolving aid: propylene glycol butyl ether 1% by weight
[0078] pH buffer: Sodium hydrogen phosphate 1% by weight
[0079] Phosphoric acid was used as a pH adjuster to adjust the pH to 5.5.
[0080] For the surface-treated substrate of Example 1, a hydrogen sulfide gas test was performed based on JISH8502 without heat treatment (hydrogen sulfide concentration: 3ppm, temperature: 40°C, humidity: 80%RH, test time: 4 hours) , to observe the appearance with the naked eye. In addition, after heat treatment at 200° C. ...
Embodiment 2~8
[0086] Embodiment 2~8, comparative example 1~8
[0087] Inhibitor and pH buffering agent in embodiment 1 are changed into compound and concentration recorded in table 1, and the pH value is changed into the value shown in table 1 with phosphoric acid, except that, carry out treated group similarly with embodiment 1 The surface treatment of the material was evaluated in the same manner as in Example 1.
[0088] The results are shown in Table 1.
[0089] [Table 1]
[0090]
[0091] Using the surface-treated substrates of Examples 1, 2, 7, and Comparative Example 1, evaluations of contact resistance, solder wettability, wire bonding properties, and reflectance were performed in the following manner. The results are shown in Table 2.
[0092] (1) Contact resistance
[0093] The contact resistance was measured at a DC of 7.4 mA, an open voltage of 20 mV, and a load of 2.5 to 50 g. The criteria for judging the contact resistance are as follows.
[0094] ○: Contact resistanc...
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