Method for manufacturing front-mounted three-dimensional line on single side of chip by using first etching and later packaging and packaging structure of three-dimensional line

Abstract

The invention relates to a method for manufacturing a front-mounted three-dimensional line on single side of a chip by using first-etching later-packaging and a packaging structure of the three-dimensional line. The method comprises the following steps of: taking a metal substrate; pre-plating copper on the surface of the metal substrate; coating green paint; removing a part of green paint on the back side of the substrate; electro-plating an inert metal line layer; electro-plating a metal line layer; coating the grain paint; removing a part of green paint on the back side of a substrate; electro-plating the metal line layer; coating the green paint; removing a part of the green paint on the back side of the substrate; coating a line screen plate; pre-treating metallization; removing the line screen plate; electro-plating the metal line layer; coating the green paint; removing a part of green paint on the front side of the substrate; performing chemical etching; electro-plating the metal line layer; coating a bonding material; mounting the chip; bonding a metal line; encapsulating; arranging holes on the back side of the substrate; cleaning; reballing; and cutting to obtain a finished product. The method has the beneficial effects that the manufacturing cost is reduced, the security and the reliability of a packaging body are improved, and the environmental pollution is reduced, so that the design and the manufacture of high-density lines can be really realized.

Description

technical field [0001] The invention relates to a method for manufacturing a single-sided three-dimensional circuit on a front-mounted chip and then sealing it after etching and its packaging structure. It belongs to the technical field of semiconductor packaging. Background technique [0002] The manufacturing process flow of the traditional high-density substrate package structure is as follows: [0003] Step 1, see Figure 85 , take a substrate made of glass fiber material, [0004] Step two, see Figure 86 , opening holes at desired locations on the fiberglass substrate, [0005] Step three, see Figure 87 , coated with a layer of copper foil on the back of the glass fiber substrate, [0006] Step 4, see Figure 88 , fill the conductive material in the position where the glass fiber substrate is punched, [0007] Step five, see Figure 89 , coated with a layer of copper foil on the front of the glass fiber substrate, [0008] Step six, see Figure 90 , coated w...

AI Technical Summary

Problems solved by technology

[0019] 3. Glass fiber itself is a kind of foaming material, so it is easy to absorb moisture and moisture due to the storage time and environment, which directly affects the safety capability or reliability level of reliability;

[0020] 4. The surface of the glass fiber is covered with a copper foil metal layer thickness of about 50-100 μm, and the etching distance between the metal layer line and the line can only achieve an etching gap of 50-100 μm due to the characteristics of the etching factor (etching factor: minimum The best manufacturing capability is that the etching gap is approximately equal to the thickness of the object being etched, see Figure 97 ), so it is impossible to truly design and manufacture high-density circuits;

[0022]6. Also because the entire substrate material is made of glass fiber, the thickness of the glass fiber layer is obviously increased by 100~150μm, and it cannot be really ultra-thin encapsulation;

[0023]7. Due to the large difference in material characteristics (expansion coefficient) of the traditional glass fiber plus copper foil technology, it is easy to cause stress deformation in the harsh environment process, directly Affects the accuracy of component loading and the adhesion and reliability of components and substrates

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