Low-dielectric-constant insulating paper and preparation method thereof
A low dielectric constant, insulating paper technology, applied in insulators, organic insulators, plastic/resin/wax insulators, etc., can solve the problems of reducing the dielectric constant of insulating paper and increasing the cost of synthetic fibers, achieving low cost and improving insulation. performance, the effect of prolonging the safety life
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Embodiment 1
[0015] In this embodiment, the required test materials are: cardboard (component A), and silica hollow microspheres with an average diameter of 500 nm (component B). After the cardboard is beaten according to the general insulating paper making procedure, it is diluted to 0.4wt.%, and it is defibrated in a fiber dissociator for 3 minutes, and the shaken SiO 2 Pour the suspension of hollow microspheres into the fiber dissociator and continue to stir for 10 minutes to make it evenly mixed. The stirring temperature is normal temperature, the stirring time is 1-20min, and the stirring rate is 3000r·min -1 , SiO 2 The amount of the hollow microsphere suspension is 5wt.%, and finally, it is made into a quantitative 120g / m on a paper former. 2 After compaction, the insulating paper is dried at 105 degrees Celsius for 5 minutes to complete the preparation. The prepared insulating paper contains SiO 2 The mass percentage of hollow microspheres is 5%. SiO 2 Preparation method of hol...
Embodiment 2
[0018] In this embodiment, the required test materials are: cardboard (component A), and silica hollow microspheres with a diameter of 500 nm (component B). After beating the cardboard according to the general insulating paper making procedure, dilute it to 0.4wt.%, and dissolve it in the fiber dissociator for 3 minutes, pour the shaken SiO2 hollow microsphere suspension into the fiber dissociator and continue stirring Let it mix evenly for 10 minutes, the stirring temperature is normal temperature, the stirring time is 1-20min, and the stirring rate is 3000r·min -1 . Finally, an insulating paper with a basis weight of 120 g / m2 was made on a sheet former. After compaction, it is dried at 105 degrees Celsius for 5 minutes to complete the preparation. The mass percent of SiO2 hollow microspheres in the prepared insulating paper is 3%.
[0019] The dielectric constant of the modified insulating paper after oil immersion was measured, and the dielectric constant of the insulati...
Embodiment 3
[0021] In this embodiment, the required test materials are: cardboard (component A), and silica hollow microspheres with a diameter of 500 nm (component B). After beating the cardboard according to the general insulating paper making procedure, dilute it to 0.4wt.%, and dissolve it in the fiber dissociator for 3 minutes, pour the shaken SiO2 hollow microsphere suspension into the fiber dissociator and continue stirring Let it mix evenly for 10 minutes, the stirring temperature is normal temperature, the stirring time is 1-20min, and the stirring rate is 3000r·min -1 . Finally, an insulating paper with a basis weight of 120 g / m2 was made on a sheet former. After compaction, it is dried at 105 degrees Celsius for 5 minutes to complete the preparation. The mass percent of SiO2 hollow microspheres in the prepared insulating paper is 7%.
[0022] The dielectric constant of the modified insulating paper after oil immersion was measured, and the dielectric constant of the insulati...
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