1results about How to "Low relative permittivity" patented technology

The film for a circuit board of the present disclosure contains an inherently microporous polymer. For example, the porosity of the film is 15% or more and 50% or less. For example, the average pore diameter of the fine pores possessed by the film is 0.3 nm or more and 6 nm or less. For example, the thickness of the film is 30 µm or more and 1.0 mm or less. The circuit board of the present disclosure is provided with an insulating layer containing an inherently microporous polymer. The transmission method of the present disclosure transmits a high-frequency signal to the circuit board of the present disclosure. The method for manufacturing the film for a circuit board of the present disclosure includes the following steps: dissolving an inherently microporous polymer in a solvent to prepare a solution, applying the solution to a support to form an applied film, and removing the solvent from the applied film.