Printed circuit board

A technology of magnetic nanoparticles and insulators, applied in the direction of printed circuits, circuits, electrical components, etc., can solve the problems of low mechanical strength, unusable use, restrictions, etc., and achieve the effect of low transmission loss

Active Publication Date: 2005-11-09
SONY CORP +1
View PDF3 Cites 6 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0012] However, PCBs formed from this porous fluororesin have extremely low mechanical strength and low thermal stability
Therefore, the above PCB is hardly available for practical use
[0013] Furthermore, since there is no relative permittivity ε r For materials less than 1, conventional methods of reducing PCB losses are limited

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Printed circuit board
  • Printed circuit board
  • Printed circuit board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0094] Materials used in Embodiment 1, a method of forming a PCB, and a method of forming a transmission line will be described below.

[0095] (1) Materials used

[0096] (i) Magnetic nanoparticles: using Fe covered with oleic acid synthesized by alcohol reduction method 3 o 4 Toluene dispersion of magnetic nanoparticles. Fe 3 o 4 The average particle size of the magnetic nanoparticles is 16 nm. The standard deviation of the particle size distribution is 19% of the mean particle size.

[0097] (ii) Insulator material: Powdered polytetrafluoroethylene (average particle size: 25 μm) is used

[0098] (2) Formation method of PCB

[0099] Powdered PTFE mixed into Fe 3 o 4 magnetic nanoparticles in toluene dispersion. Among them, Fe 3 o 4 The volume ratio of magnetic nanoparticles to polytetrafluoroethylene was set at 30:70.

[0100] Then, the solution was kept at 60°C and the toluene was evaporated by stirring the solution using a high speed stirrer to obtain a black ...

Embodiment 2

[0110] Materials used in Embodiment 2, a method of forming a PCB, and a method of forming a transmission line will be described below.

[0111] (1) Materials used

[0112] (i) Magnetic nanoparticles: A toluene dispersion of oleic acid-covered Mn—Zn ferrite nanoparticles synthesized by an alcohol reduction method was used. The average particle diameter of the Mn-Zn ferrite nanoparticles is 10 nm. The standard deviation of the particle size distribution is 29% of the mean particle size.

[0113] (ii) Insulator material: Powdered polytetrafluoroethylene (average particle size: 25 μm) is used

[0114] (2) Formation method of PCB

[0115] Mix powdered PTFE into the toluene dispersion of Mn-Zn ferrite nanoparticles. Wherein, the volume ratio of Mn-Zn ferrite nanoparticles to polytetrafluoroethylene is set to 40:60.

[0116] Then, the solution was kept at 60°C and the toluene was evaporated by stirring the solution using a high speed stirrer to obtain a black residual solid mate...

Embodiment 3

[0123] Materials used in Embodiment 3, a method of forming a PCB, and a method of forming a transmission line will be described below.

[0124] (1) Materials used

[0125] (i) Magnetic nanoparticles: using Fe covered with oleic acid synthesized by pyrolysis 50 co 50 Dispersion of nanoparticles in toluene. Fe 50 co 50 The average particle size of the nanoparticles is 12 nm. The standard deviation of the particle size distribution is 17% of the mean particle size.

[0126] (ii) Insulator material: Powdered polytetrafluoroethylene (average particle size: 25 μm) is used

[0127] (2) Formation method of PCB

[0128] Mix powdered PTFE in Fe 50 co 50 nanoparticles in toluene dispersion. Among them, Fe 50 co 50 The volume ratio of nanoparticles to polytetrafluoroethylene was set at 20:80.

[0129] Then, the solution was kept at 60°C and the toluene was evaporated by stirring the solution using a high speed stirrer to obtain a black residual solid material.

[0130] Then,...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

PropertyMeasurementUnit
The average particle sizeaaaaaaaaaa
The average particle sizeaaaaaaaaaa
The average particle sizeaaaaaaaaaa
Login to view more

Abstract

A PCB that can transmit a high frequency signal of a GHz band with a low loss includes an insulator and magnetic nanoparticles dispersed in the insulator.

Description

technical field [0001] The present invention relates to a printed circuit board (PCB) for high frequency on which a GHz band high frequency circuit element is mounted, and more particularly to a PCB capable of transmitting signals with low power consumption. [0002] This application claims the Japanese patent application with application number 2004-058947 filed on March 3, 2004 and Japanese patent application with application number 2005-007887 filed on January 14, 2005 as priority, which All are incorporated herein by reference. Background technique [0003] In recent years, the frequency of signals operating high-frequency semiconductor elements has increased remarkably in accordance with demands for high-speed information processing and high-speed and high-density information communication. For example, LSI chips currently used for computer CPUs operate at a clock frequency of several GHz. In addition, high-frequency signals in the GHz band are used in satellite broad...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): H01L23/14
Inventor 水野干久佐佐木勇一井上诚矢泽健児高桥研馆野安夫宫内贞一
Owner SONY CORP
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap