Curing method and curing device for frame sealing glue
A curing device and sealing glue technology, applied in the direction of electric heating devices, optics, instruments, etc., can solve the problems of incomplete curing, long curing time, complicated curing device, etc., and achieve improved physical properties, high curing efficiency, and shortened curing time Effect
Active Publication Date: 2015-05-13
BEIJING BOE OPTOELECTRONCIS TECH CO LTD
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Problems solved by technology
[0011] The object of the present invention is to provide a curing method and curing device for frame sealant to solve the problems of complex curing devices, long curing time and incomplete curing in the prior art
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[0038] The invention provides a method for curing the frame sealing glue. During the curing of the frame sealing glue, a microwave radiation curing method is used to cure the frame sealing glue.
[0039] Materials can produce physical phenomena such as temperature rise and melting under the action of microwaves. At the same time, chemical reactions will occur. Microwave radiation can generate heat, which will increase the temperature of the material and cause curing reactions. The current microwave radiation curing technology mainly targets free radical polymerization ( Such as acrylic resin, unsaturated polyester / styrene system) / lactone ring-opening polymerization, epoxy resin / amine and epoxy resin / anhydride, etc., the above compounds have no volatile substances present or generated during the thermal crosslinking process. It can ensure the safety of microwave curing. Furthermore, the frame sealant used in the liquid crystal display field contains acryl and epoxy resins, among w...
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Abstract
Provided are a curing method and a curing device for a frame-sealing adhesive. In the method, the curing of the frame-sealing adhesive is achieved by microwave. The curing device comprises: a housing (20); a moving component (21) disposed on the housing (21) and having two states of opening and closing, the moving component (21) in a closure state and the housing (20) forming a closed chamber (24) for containing a substrate; a support (22) disposed in the chamber (24) for the substrate to be placed on; and a microwave-generating device (23) disposed in the chamber (24). The curing method and curing device for the frame-sealing adhesive reduce the blending and polluting time of liquid crystal and the frame-sealing adhesive, avoid the interference of other conditions, allow the curing of the frame-sealing adhesive to become more complete, and can eliminate the poor curing of traditional processes.
Description
Technical field [0001] The invention relates to the field of liquid crystal display, in particular to a curing method and a curing device for frame sealing glue. Background technique [0002] In the field of liquid crystal display, in the cell formation stage of the array substrate and the color filter substrate, the frame sealing glue needs to be cured. The frame sealing glue generally contains acryl-based compounds and epoxy-based resin compounds. [0003] Ultraviolet light can cure acryl-based compounds, and thermal curing can cure epoxy-based resin compounds. Therefore, in the prior art, a combination of ultraviolet curing and thermal curing is generally used to heat up and melt the sealant, and at the same time make it chemically Reaction to achieve the curing effect. [0004] When using ultraviolet curing, the frame sealant curing device needs to provide an ultraviolet light source 11 in the ultraviolet curing oven, set the light source irradiation angle 12, and need to set a ...
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IPC IPC(8): G02F1/1339
CPCH05B6/80G02F1/1303G02F1/1339H05B2206/046
Inventor 刘方兴程凌志孔德钱
Owner BEIJING BOE OPTOELECTRONCIS TECH CO LTD