Thick glue photoetching electroforming technology-based manufacture method of three-dimensional MEMS (micro-electromechanical systems) supercapacitor

A technology for supercapacitors and manufacturing methods, applied in the direction of electrolytic capacitors, capacitors, circuits, etc., can solve the problems of increased integration of liquid electrolytes, low performance of supercapacitors, limited research on supercapacitors, etc., to achieve increased effective surface area, high energy Density, the effect of increasing specific energy and specific power
CN102751104AActive Publication Date: 2012-10-24GMCC ELECTRONICS TECH WUXI CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Current Assignee / Owner
GMCC ELECTRONICS TECH WUXI CO LTD
Publication Date
2012-10-24

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Abstract

The invention relates to a thick glue photoetching electroforming technology-based manufacture method of a three-dimensional MEMS (micro-electromechanical systems) supercapacitor. The supercapacitor has the structure of a comb tooth-shaped inserting finger. The method comprises the following steps of: on the substrate of a silicon wafer, taking SU-8 thick glue photoetching as a temperate, depositing a current collector in the template in an electroforming technology, electrically and chemically polymerizing a conducting polymer on the current collector to be taken as an active electrode material of the supercapacitor, and finally covering a layer of solid electrolyte. The supercapacitor has the three-dimensional structure, so that the superficial area of the electrode can be effectively enlarged, therefore, the energy density and the power density can be greatly improved relative to a flat plate structure. Furthermore, the safety performance of the method can be improved due to the use of solid electrolyte.
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Description

technical field

[0001] The invention relates to a method for manufacturing a MEMS supercapacitor based on a thick glue photolithography electroforming process. Background technique

[0002] Supercapacitor (ultracapacitor) is a new type of energy storage device between traditional capacitors and batteries. It has the advantages of high power density, short charge and discharge time, long cycle life, and good low temperature performance. Ultracapacitors are used in a wide range of military and civilian applications, ranging from micron-level wireless sensors to starting devices for rockets and satellites. According to the latest research by Lux, ultracapacitors have huge market potential, and the revenue of the entire ultracapacitor market is expected to break through from US$208 million in 2008 to US$877 million in 2014.

[0003] Small ultracapacitors can be integrated with IC circuits due to portable electronic devices, etc. The supercapacitor integrated with IC current ca...

Claims

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