Laminates for flexible wiring boards

Abstract

A laminate for flexible wiring in which copper plating is entirely or locally applied on a copper foil that is cladded on an insulating resin substrate, characterized in that a ratio A = [(200) / {(111) + (200) + (220) + (311)}] × 100, i.e. a ratio of an area intensity of a peak in the X-ray diffraction of the copper plating surface is more than 90. The present invention can provide the laminate for flexible wiring in which copper plating is entirely or locally applied on a copper foil cladded on an insulating resin substrate, characterized in having particularly high bendability and enables the formation of fine patterns, namely, high dense patterns of wiring.

Description

technical field [0001] The present invention relates to a laminate for a flexible wiring board in which copper plating is wholly or partially applied to copper foil attached to an insulating resin substrate, and relates to a laminate having particularly high flexibility and enabling fine patterning (higher density) of wiring. ) laminates for flexible wiring boards. Background technique [0002] In recent years, with the development of miniaturization technology for mounting components such as semiconductor devices and various electronic chip components, wiring Further fine patterning and bendability of the laminate. [0003] Printed wiring boards based on organic materials are roughly divided into rigid copper-clad laminates (rigid) with epoxy glass substrates and phenolic paper substrates as constituent materials, and flexible laminates with polyimide substrates or polyester substrates as constituent materials. Flexible (flexible) copper-clad laminate substrates, and copp...

AI Technical Summary

Problems solved by technology

[0016] In this case, since the thickness of the metal foil does not change, it is presumed that the bendability or flexibility is improved, but there is a disadvantage that extremely high plating is required because the plating area must be formed to be small and thin. Accuracy; in the case of densely arranged vias, the routing density cannot be increased

[0018] However, the problem in this case is that when conduction is conducted from one surface to the other surface through a via hole, the copper layer on one side conducts over a large area, while the copper layer on the other side is only connected to the copper layer. The extremely narrow area of ​​the partial cross-sectional area of ​​a layer

Moreover, when forming a through hole, if the copper layer does not form a smooth interface, there is a problem that it cannot conduct with the through hole, and thus cannot conduct with the other side.

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