Water-base tape casting slurry and water-base tape casting wet method for preparing multilayer chip component

A water-based casting, multi-layer chip technology, applied in the field of chip ceramic electronics, can solve the problems of easy cracking of the green body, poor diaphragm effect, poor powder wettability, etc., to reduce production costs and reduce ball milling time. , the effect of good solubility

Active Publication Date: 2012-10-31
SHENZHEN ZHENHUA FU ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the water-soluble dispersant and binder used in the existing water-based casting technology are not suitable, and the water-based casting technology uses water as a solvent at the same time. The wettability of the body is poor, it is easy

Method used

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  • Water-base tape casting slurry and water-base tape casting wet method for preparing multilayer chip component
  • Water-base tape casting slurry and water-base tape casting wet method for preparing multilayer chip component
  • Water-base tape casting slurry and water-base tape casting wet method for preparing multilayer chip component

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0061] Water-based casting slurry and water-based casting wet method for preparing multilayer chip inductors:

[0062] (1) The formula of water-based casting slurry is weighed ceramic powder, polyvinyl alcohol, ammonium polyacrylate, polyethylene glycol, ethylene glycol butyl ether, acrylic resin, defoamer and water components, first Mix water with ammonium polyacrylate and ceramic powder and ball mill for 12 hours, adjust the pH value to 9.5 at the same time, then add polyvinyl alcohol, polyethylene glycol, defoamer and ball mill again for 24 hours to produce water-based cast slurry The formula of the water-based casting slurry is: based on the total weight of the water-based casting slurry as 100%, the weight percentage of ceramic powder is 50.0%, the weight percentage of polyvinyl alcohol is 9%, polyacrylic acid The weight percentage of ammonium is 2%, the weight percentage of polyethylene glycol is 1%, the cosolvent ethylene glycol butyl ether is 9.3%, the acrylic resin is...

Embodiment 2 to Embodiment 6

[0073] Water-based casting slurry and water-based casting wet method for preparing multilayer chip inductors:

[0074] Referring to the formula of water-based casting in Example 1, keep the contents of ceramic powder, ammonium polyacrylate, polyethylene glycol, ethylene glycol butyl ether, acrylic resin and water components unchanged, and adjust the content of polyvinyl alcohol respectively To 11%, 10%, 9%, 8%, 7%. The water-based casting slurries prepared in Examples 2 to 6 were respectively cast to prepare thin strips, and the properties of the thin strips are shown in Table 2 below.

[0075] Table 2

[0076]

[0077] It can be seen from Table 2 that the viscosity of water-based casting slurry is jointly determined by the content of binder and ceramic powder. If the binder content is too low, the strength of the thin strip will be low; if the binder content is too high, the strength of the thin strip will be increased, but the pores of the slurry will not be easily elim...

Embodiment 7 to Embodiment 11

[0079] Water-based casting slurry and water-based casting wet method for preparing multilayer chip inductors:

[0080] Referring to the formula of water-based casting in Example 1, keep the content of ceramic powder, ammonium polyacrylate, polyvinyl alcohol, ethylene glycol butyl ether, acrylic resin and water components unchanged, and adjust the content of polyethylene glycol respectively To 0.2%, 0.4%, 0.6%, 0.8%, 1.0%. The water-based casting slurries prepared in Examples 7 to 11 were respectively cast to prepare thin strips, and the properties of the thin strips are shown in Table 3 below.

[0081] table 3

[0082]

[0083] It can be seen from Table 3 that the content of polyethylene glycol affects the related properties of the thin tape prepared by casting using the water-based casting slurry containing polyethylene glycol, such as affecting the flexibility and flatness of the thin tape. As the content of polyethylene glycol increases, the flexibility of the thin tap...

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PUM

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Abstract

The invention provides water-base tape casting slurry and a water-base tape casting wet method for preparing a multilayer chip component. The water-base tape casting slurry comprises, by weight, from 40.0 to 50.0% of ceramic powder, from 5.0 to 10.0% of polyvinyl alcohol, from 0.2 to 1.2% of ammonium polyacrylate, from 0.4 to 2.4% of polyethylene glycol, from 0.1 to 0.5% of defoaming agent and from 30 to 48% of water. The water-base tape casting wet method includes preparing the water-base tape casting slurry; preparing a ceramic matrix; preparing a green chip of the multilayer chip component; and preparing the multilayer chip component. The water-base tape casting slurry is moderate in viscosity and short in drying time and is safe and nontoxic; the ceramic matrix prepared from the slurry is uniform in structure and smooth in surface; and the water-base tape casting wet method for preparing the multilayer chip component is simple in process and is safe, nontoxic, economical and environment-friendly, the prepared multilayer chip component is firm in structure, the thickness of the multilayer chip component can reach 20 micrometers, the inductance value of the multilayer chip component is high, yield of multilayer chip components reaches 90% at least, and production cost is lowered by 75% at least.

Description

technical field [0001] The invention belongs to the technical field of chip ceramic electronic devices, and in particular relates to a water-based casting slurry and a method for preparing multi-layer chip components by a water-based casting wet method. Background technique [0002] With the miniaturization, light weight, high performance of electronic equipment and the development of surface assembly technology, the high-density surface assembly of chip electronic components has developed rapidly. In particular, the rapid development of mobile communications, audio-visual technology, notebook computers and large-screen color TVs has created a huge demand for electronic components. At present, the chip rate of resistors and capacitors has reached 86% and 84%, and the chip rate of inductors has reached 52%. Miniaturization, high frequency, serialization, and integration are becoming the main development direction of international chip components. The size of chip components...

Claims

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Application Information

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IPC IPC(8): C04B35/26C04B35/453C04B35/468C04B35/622C04B35/634
Inventor 周正有丁晓鸿李建辉胡彩波朱建华肖倩周俊
Owner SHENZHEN ZHENHUA FU ELECTRONICS
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