Water-base tape casting slurry and water-base tape casting wet method for preparing multilayer chip component

Abstract

The invention provides water-base tape casting slurry and a water-base tape casting wet method for preparing a multilayer chip component. The water-base tape casting slurry comprises, by weight, from 40.0 to 50.0% of ceramic powder, from 5.0 to 10.0% of polyvinyl alcohol, from 0.2 to 1.2% of ammonium polyacrylate, from 0.4 to 2.4% of polyethylene glycol, from 0.1 to 0.5% of defoaming agent and from 30 to 48% of water. The water-base tape casting wet method includes preparing the water-base tape casting slurry; preparing a ceramic matrix; preparing a green chip of the multilayer chip component; and preparing the multilayer chip component. The water-base tape casting slurry is moderate in viscosity and short in drying time and is safe and nontoxic; the ceramic matrix prepared from the slurry is uniform in structure and smooth in surface; and the water-base tape casting wet method for preparing the multilayer chip component is simple in process and is safe, nontoxic, economical and environment-friendly, the prepared multilayer chip component is firm in structure, the thickness of the multilayer chip component can reach 20 micrometers, the inductance value of the multilayer chip component is high, yield of multilayer chip components reaches 90% at least, and production cost is lowered by 75% at least.

Description

technical field [0001] The invention belongs to the technical field of chip ceramic electronic devices, and in particular relates to a water-based casting slurry and a method for preparing multi-layer chip components by a water-based casting wet method. Background technique [0002] With the miniaturization, light weight, high performance of electronic equipment and the development of surface assembly technology, the high-density surface assembly of chip electronic components has developed rapidly. In particular, the rapid development of mobile communications, audio-visual technology, notebook computers and large-screen color TVs has created a huge demand for electronic components. At present, the chip rate of resistors and capacitors has reached 86% and 84%, and the chip rate of inductors has reached 52%. Miniaturization, high frequency, serialization, and integration are becoming the main development direction of international chip components. The size of chip components...

AI Technical Summary

Problems solved by technology

However, the water-soluble dispersant and binder used in the existing water-based casting technology are not suitable, and the water-based casting technology uses water as a solvent at the same time. The wettability of the body is poor, it is easy to generate a large number of bubbles, it is difficult to remove the bubbles, and the green body is easy to crack during the debinding process, which makes the film effect poor and cannot meet the current huge demand for chip electronic components.

Images