Preparation method of anaerobic tin based solder alloy

A technology of tin alloys and alloys, which is applied in the field of preparation of oxygen-free tin-based solder alloys, can solve the problems of increased oxygen content, increased oxygen content, and unfavorable use of products, and achieve the effect of solving the problem of increased oxygen content

Active Publication Date: 2012-11-14
云南锡业锡材有限公司
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  • Abstract
  • Description
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  • Application Information

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Problems solved by technology

Most of the pouring method is manual pouring, that is, the operator uses a container to scoop out the tin on the surface of the tin liquid and then injects it into the mold. The cooling process is completely exposed to the air. On the one hand, the gas and impurities will float to the liquid surface after the tin liquid stands still. , the method of taking liquid from the surface inevitably mixes gas and impurities into the product. On the other hand, the crystalliz

Method used

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  • Preparation method of anaerobic tin based solder alloy

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Embodiment 1

[0015] Embodiment 1: Apply the method of the present invention to produce SnCu0.7 lead-free solder. First, qualified tin raw materials and tin-copper intermediate alloy materials are prepared in a certain proportion, weighed, and put into a power frequency induction furnace for melting. Set the temperature of the power frequency induction furnace to 400°C, then turn on the graphite rotor, set the speed to 80 rpm, turn on the quantitative pump, blow nitrogen (0.3MPa) and hexachloroethane (0.2%) into the tin liquid, after 40min , remove the surface scum. Then open the diversion switch to guide the liquid into the holding furnace until the upper liquid level control line, and close the diversion switch. Set the temperature of the holding furnace at 380°C, turn off the cooling water of the crystallizer, put a draw rod into the crystallizer and gently tap it into the crystallizer, slowly guide the draw rod to the traction wheel with pliers, press the traction wheel, and start the ...

Embodiment 2

[0016] Embodiment 2: Apply the method of the present invention to produce SnAg3.0Cu0.5 lead-free solder. Qualified tin raw materials, tin-copper intermediate alloy materials, and silver raw materials are prepared in a certain proportion, weighed, and put into a power frequency induction furnace for melting. Set the temperature of the power frequency induction furnace to 380°C, then turn on the graphite rotor, set the speed to 80 rpm, turn on the quantitative pump, blow nitrogen (0.3MPa) and hexachloroethane (0.2%) into the tin liquid, after 40min , remove the surface scum. Then open the diversion switch to guide the liquid into the holding furnace until the upper liquid level control line, and close the diversion switch. Set the temperature of the holding furnace at 350°C, turn off the cooling water of the crystallizer, put a draw rod into the crystallizer and gently tap it into the crystallizer, slowly guide the draw rod to the traction wheel with pliers, press the traction ...

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Abstract

The invention belongs to the field of soft solder for soft solder welding in electronic industry, and in particular relates to a preparation method of an anaerobic tin based solder alloy. The method comprises the following steps of: (1) melting tin and alloy materials in a melting furnace, blowing, stirring and refining nitrogen and a hexachloroethane refining agent for 30-40 minutes, then standing for 15-20 minutes, and skimming the surface floating scruff, wherein the hexachloroethane refining agent accounts for 0.1-0.2% of the total weight of melt; (2) guiding a tin alloy liquid in the melting furnace into a temperature preservation furnace of 350-380 DEG C, introducing protective nitrogen, and guiding the tin alloy liquid by a traction rod through a crystallizer by a traction machine, wherein the water inlet temperature of cooling water in the crystallizer is 20-25 DEG C, and the water outlet temperature is 30-35 DEG C, and the traction speed is 0.3-0.5m/min; and (3) carrying out secondary spraying and cooling after traction instantly, thus the temperature of a rod blank is reduced to 30-50 DEG C, thereby obtaining a finished product finally. According to the invention, the tin based solder alloy which has high purity, is uniform in component, and has the oxygen content within 10ppm can be prepared, the production process is stable, and the continuous scale production can be realized.

Description

technical field [0001] The invention belongs to the field of solder used for soldering in the electronics industry, and in particular relates to a preparation method of an oxygen-free tin-based solder alloy. Background technique [0002] With the rapid development of the electronics industry, the amount of tin solder is increasing. There are no more than two methods for preparing tin-based solder products currently used in the electronics industry, one is the pouring method and the other is the extrusion method. Most of the pouring method is manual pouring, that is, the operator uses a container to scoop out the tin on the surface of the tin liquid and then injects it into the mold. The cooling process is completely exposed to the air. On the one hand, the gas and impurities will float to the liquid surface after the tin liquid stands still. , the method of taking liquid from the surface inevitably mixes gas and impurities into the product. On the other hand, the crystalliz...

Claims

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Application Information

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IPC IPC(8): C22C1/03C22C1/06C22C13/00B23K35/26
Inventor 白海龙刘宝权赵玲彦秦俊虎古列东吕金梅沈海斌汤凤甦
Owner 云南锡业锡材有限公司
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