Production process of ordinary electric rectifier diode chip

A rectifier diode and production process technology, which is applied in the production process field of ordinary power rectifier diode chips, can solve problems such as acid corrosion, poor thermal fatigue resistance of chips, and single variety, so as to improve the ability of working voltage and solve thermal fatigue problems , The effect of small on-state voltage drop

Active Publication Date: 2012-11-21
HUANGSHAN 777 ELECTRONICS CO LTD
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  • Abstract
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  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0011] 6. Acid corrosion
[0016] The manufacturing process of traditional ordinary power rectifier diode chips is relatively backward, and the voltage carrying capacity of the manufactured rectifier diodes is not high, the variety is relatively single, and the application range is relatively narrow
The chip has poor thermal fatigue resistance and poor appearance recognition

Method used

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  • Production process of ordinary electric rectifier diode chip
  • Production process of ordinary electric rectifier diode chip
  • Production process of ordinary electric rectifier diode chip

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Embodiment Construction

[0043] Step 2. After the cutting is completed, the chip is thinned and cleaned to make the surface of the chip clean;

[0044] Step 3, chip press-fit layer structure, please refer to figure 1 As shown, vacuum sintering. After the chip is cleaned, follow the following multi-layer structure from bottom to top: molybdenum sheet 1, aluminum foil 2, single crystal silicon sheet 3, and vacuum sinter in a sintering furnace to form a molybdenum-aluminum-silicon phase alloy on the anode surface. The sintering temperature is between 660°C and 680°C for 30 minutes, vacuum evaporation and vacuum microalloying, the aluminum film 4 is evaporated on the cathode surface of the entire single crystal silicon wafer, and the vacuum microalloying makes the anode surface of the chip form an aluminum-silicon phase alloy , the multi-layer crimping chip structure replaces the traditional welded structure of the ordinary power rectifier chip, and due to the existence of the crimping multi-layer struc...

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Abstract

The invention relates to a whole set of production process of an ordinary electric rectifier diode chip. From the beginning to the end, the whole production process comprises the steps of wire cutting, washing, vacuum sintering, vacuum evaporation and vacuum microalloying, black rubber protection, angle lapping, acid corrosion, rubber protection, room temperature vulcanization, high temperature solidification, detection and packaging. A washed monocrystalline silicon piece is in the following multi-layer structure which is sequentially provided with a molybdenum piece, aluminum foil and a monocrystalline silicon piece from bottom to top, the vacuum sintering is carried out in a sintering furnace, and then an aluminum film is evaporated onto the whole monocrystalline silicon piece; and the angle lapping is carried out in a multi-angle matched grinding process. The production process disclosed by the invention has the advantages that a chip with a novel structure is produced, and the table board modeling mode of a single angle table board of the conventional electric rectifier diode chip is broken through. The new application technology of the multi-angle matched grinding process enables the table board of the chip to have a more perfect multi-angle table board model. The capacity of bearing higher working voltage of the electric rectifier diode chip is effectively improved.

Description

technical field [0001] The invention relates to a production process of semiconductor components, in particular to a production process of a common power rectification diode chip. Background technique [0002] A rectifier is a semiconductor component that converts alternating current into pulsating direct current in one direction. The chip in the rectifier tube is mostly made of semiconductor material monocrystalline silicon. Ordinary power rectifier diodes have unidirectional conductivity, and their unidirectional conductivity is often used in working circuits to rectify and protect the circuit. ZP series ordinary power rectifier diodes are widely used in electric power, construction, metallurgy, national defense and other industries, such as: state-owned large-scale electric power and industrial and mining equipment, electric welding machines, ship excitation, traction of large electric locomotives, etc. [0003] The chip table tops of traditional ordinary power rectifie...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/329
Inventor 戴立新
Owner HUANGSHAN 777 ELECTRONICS CO LTD
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