Hexaaluminate high-emissivity thermal protection coating layer and preparation method thereof
A high-emissivity, hexaaluminate technology is applied in coating, metal material coating process, fusion spraying, etc. It can solve the problems of good thermal shock resistance and high thermal expansion ratio, and achieve thermal expansion mismatch, Improve the effect of radiation heat transfer and solve the effect of poor thermal shock resistance
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specific Embodiment approach 1
[0026] Specific implementation mode 1: A hexaaluminate high emissivity thermal protective coating according to this embodiment is characterized in that the chemical formula of the hexaaluminate high emissivity thermal protective coating is LaMg 1-x m x Al 11 o 19 ; wherein, M is Mn, Fe, Co or Ni, 0≤x≤1.
specific Embodiment approach 2
[0027] Embodiment 2: A method for preparing a hexaaluminate high-emissivity thermal protective coating according to this embodiment is carried out in the following steps:
[0028] 1. Al 2 o 3 and La 2 o 3 Put it into a muffle furnace, and conduct heat treatment at a temperature of 600-1200 °C for 2-10 hours to obtain Al 2 o 3 Powder and La 2 o 3 powder;
[0029] 2. According to the chemical formula LaMg 1-x m x Al 11 o 19, according to the stoichiometric ratio, weigh the Al obtained in step 1 2 o 3 Powder, La 2 o 3 Powder and A are mixed to obtain a powder mixture; wherein, the chemical formula LaMg 1-x m x al 11 o 19 M is Mn, Fe, Co or Ni, 0≤x≤1; A is MgO, MnO 2 , Fe 2 o 3 , CoO, Ni 2 o 3 One of MgO and MnO 2 , Fe 2 o 3 , CoO, Ni 2 o 3 A mixture in any proportion; MgO needs to be heat-treated by the method of step 1 before weighing;
[0030] 3. Put the powder mixture obtained in step 2 into a ball mill bottle, and add ZrO 1 to 4 times the mass of ...
specific Embodiment approach 3
[0038] Specific Embodiment 3: This embodiment differs from Specific Embodiment 2 in that the heat treatment is carried out at a temperature of 900° C. as described in Step 1. Other steps and parameters are the same as in the second embodiment.
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