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Electrocondution slurry for chip component termination electrode

A technology of conductive paste and terminal electrodes, applied in the direction of conductive materials dispersed in non-conductive inorganic materials, etc., can solve the problems of decreased sintering density, decreased adhesion strength of terminal electrodes, and reduced metal content of conductive pastes

Inactive Publication Date: 2015-05-13
廖晓峰
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0010] However, reducing the metal content of the electroconductive paste has a negative effect, that is, the sintering density will decrease
When the sintering density drops to a certain level, in the subsequent electroplating process, the electroplating solution will penetrate into the interior of the terminal electrode, causing a significant decrease in the adhesion strength of the terminal electrode.

Method used

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  • Electrocondution slurry for chip component termination electrode
  • Electrocondution slurry for chip component termination electrode
  • Electrocondution slurry for chip component termination electrode

Examples

Experimental program
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Effect test

Embodiment 11

[0043] In Example 11, no silver micropowder was added, and the adhesion strength of the terminal electrode was as good as that of Example 13 with 10% silver micropowder added. It shows that when the silver content is high, silver paste with excellent performance can be produced without adding silver micropowder.

[0044] However, when the silver content is 55% and 65%, the adhesion strength of the terminal electrode is very low in Examples 1 and 6 without adding silver micropowder. When the amount of silver micropowder added is less than 5% of the total amount of silver powder, The adhesion strength of the terminal electrode is also very low, as in Example 2 and Example 7. In Example 3 and Example 8 with the addition of 10% silver micropowder, the adhesion strength of the terminal electrode is very good, which is equivalent to the silver paste with 75% silver content. When the amount of added silver micropowder is greater than 50% of the total amount of silver powder, the adh...

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Abstract

The invention provides electrocondution slurry used for a chip component termination electrode. The electrocondution slurry comprise the following components in percentage by weight: 45-75% of silver powder, 2-10% of glass powder, 20-50% of organic carriers and 0-3% of inorganic additives. The chip component termination electrode manufactured by the electrocondution slurry can reduce thickness of a silver layer obviously, thus reducing manufacturing cost of a chip component obviously.

Description

technical field [0001] The invention relates to a conductive paste used for terminal electrodes of chip elements. More specifically, the present invention relates to a silver conductive paste for terminal electrodes of chip components, which can significantly reduce the thickness of silver layer and the manufacturing cost of chip components. Background technique [0002] Usually, when manufacturing chip components, such as chip ceramic capacitors and laminated chip inductors, it is necessary to coat both ends of the sintered ceramic body with conductive paste. The coating process is usually dipping, and then drying. , sintered to form terminal electrodes. In order to improve the welding performance, metal layers, such as nickel plating and tin plating, are generally plated on the terminal electrodes. [0003] The above-mentioned conductive paste uses metal powder, glass powder and organic carrier as the main components, wherein the metal powder can be silver, copper or oth...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01B1/22
Inventor 廖晓峰
Owner 廖晓峰
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