MEMS (micro-electromechanical systems) device and vacuum encapsulation method of wafer level thereof
A device and silicon structure technology, which is applied in the field of MEMS devices and their vacuum packaging based on silicon-silicon bonding technology, can solve the problems of poor air tightness and difficult electrical interconnection of MEMS devices in wafer-level vacuum packaging, and is convenient for promotion and application. , Reduce the cost of packaging, good air tightness
Active Publication Date: 2013-01-09
EAST CHINA INST OF OPTOELECTRONICS INTEGRATEDDEVICE
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Abstract
The invention relates to an MEMS (micro-electromechanical systems) device and a vacuum encapsulation method of the wafer level thereof. The device is characterized in that wafer level vacuum encapsulation is realized by adopting a silicon-silicon direct bonding technology, a low-resistance silicon wafer is adopted in a silicon structure layer (15) bonded to a silicon substrate, and is directly etched on the silicon layer to form an electrical interconnection lead wire (5); and aluminum electrode (14) is sputtered on an electrical interconnection lead wire bonding area (4) in a lead wire through hole (13) of a silicon nut cap (12). The device has the advantages that a total silicon structure is adopted, and no residual stress exits after bonding, so that the working performance of the device can be greatly improved; low-resistance silicon is utilized as an electrode lead wire, so that damage of high temperature to a metal electrode in the silicon-silicon direct bonding process can be avoided; and the silicon-silicon direct bonding air tightness is extremely good, so that the encapsulation cost is greatly reduced. The method is high in accordance and reliability, and the process is easily implemented.
Application Domain
Precision positioning equipmentSolid-state devices +6
Technology Topic
Aluminum electrodeWork performance +10
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