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Annular super-hard abrasive wire and method for manufacturing same

A superabrasive and the technology of the production method are applied in the direction of manufacturing tools, sawing machine tool manufacturing, metal sawing equipment, etc., which can solve the problems of wide kerf, low efficiency, and poor cutting surface quality, and achieve smooth cutting surface, The effect of uniform thickness and low cutting cost

Active Publication Date: 2013-01-16
中国有色桂林矿产地质研究院有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In order to solve the problems of wide kerf, low efficiency, and poor cutting surface quality during the cutting operation of the existing diamond wire saw, the present invention proposes a ring-shaped superabrasive wire and its manufacturing method

Method used

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  • Annular super-hard abrasive wire and method for manufacturing same
  • Annular super-hard abrasive wire and method for manufacturing same
  • Annular super-hard abrasive wire and method for manufacturing same

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Embodiment Construction

[0031] Below in conjunction with accompanying drawing, technical scheme of the present invention will be further described:

[0032] The matrix of the annular superabrasive wire of the present invention is a wire rope 1 of 0.1 mm to 6 mm, and the wire rope 1 is a section of metal wire or non-metal wire, or a multi-strand metal filament or multi-strand metal wire twisted on the core wire 3. Strands of non-metallic filaments, such as figure 1 As shown, the silk rope 1 adopts a 1×7 rope (a core wire 3 in the middle and six metal or non-metal strands 5 twisted on it), and the two ends of the silk rope 1 are connected to form a circular silk rope 1; the superabrasive particles 2 are uniformly coated and consolidated on the surface of the silk rope 1 to form a superabrasive layer, and the superabrasive layer is a single particle thickness layer; the superabrasive layer can be a continuous layer, or Can be a discontinuous layer, such as image 3 As shown; the particle diameter of t...

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Abstract

The invention discloses an annular super-hard abrasive wire and a method for manufacturing the same. The annular super-hard abrasive wire comprises a rope, super-hard abrasive particles and a coating, wherein the size of the rope ranges from 0.1mm to 6mm, the super-hard abrasive particles are solidified on the surface of the rope, and the coating is used for solidifying the super-hard abrasive particles. The method for manufacturing the annular super-hard abrasive wire includes braiding the thin rope to form a ring with an optional perimeter; and then solidifying the super-hard abrasive particles on the surface of the annular rope by means of coating to form the high-strength annular super-hard abrasive wire with the uniform outer diameter and a long service life. The annular super-hard abrasive wire is low in cost, high in fatigue strength, long in service life, good in cutting quality and high in cutting efficiency, and a cutting machine with the annular wire can be used for cutting conductors, semiconductors and non-conductor materials.

Description

(1) Technical field: [0001] The invention relates to cutting tools for precious metals, semiconductors and non-conductors, in particular to an annular superhard abrasive wire and a manufacturing method thereof. (2) Background technology: [0002] Brittle and hard materials such as silicon, sapphire, and ceramics have high hardness and high brittleness, and are prone to chipping and damage during the cutting process, causing damage to the material and reducing the yield. Therefore, these materials are difficult to cut by ordinary processing methods. Traditional semiconductor materials and ceramic materials are usually cut by diamond inner circle and outer circle cutting technology, diamond band saw. With the development of the semiconductor industry, the diameter of monocrystalline silicon ingots is getting larger and larger, reaching 450 mm, and polycrystalline silicon ingots are also 800 mm. At present, band saws are mainly used for cutting, truncating and squaring. The cu...

Claims

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Application Information

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IPC IPC(8): B23D65/00
Inventor 陈超王进宝
Owner 中国有色桂林矿产地质研究院有限公司
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