Method for thinning sapphire substrate
A sapphire substrate, femtosecond laser technology, applied in metal processing equipment, welding equipment, manufacturing tools, etc., can solve the problems of cracks, difficulty in obtaining high-quality optical surfaces, cracks, etc., and achieve the effect of high optical surface quality
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[0009] In order to make the technical problems, technical solutions and beneficial effects solved by the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.
[0010] The invention provides a method for thinning a sapphire substrate, which is characterized in that it comprises the following steps:
[0011] (1) Use femtosecond laser to irradiate the sapphire substrate to produce color centers;
[0012] (2) Scan the surface of the sapphire substrate with an ultraviolet laser.
[0013] Compared with contact grinding and polishing, the method for thinning the sapphire substrate provided by the present invention does not exert pressure on the sapphire substrate, the substrate is less prone to cracks or cracks on the surface, and th...
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