High-thermal conductivity conductive silver adhesive and preparation method thereof

A conductive silver glue, high thermal conductivity technology, applied in conductive adhesives, adhesives, epoxy resin glue and other directions, can solve the problem of not mentioning Ag powder, increase the contact area between silver powder and silver powder, etc., to achieve simple production equipment , easy to operate effect

Active Publication Date: 2013-02-13
SHANGHAI RES INST OF MATERIALS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The above documents have improved the electrical and thermal conductivity of the conductive silver glue by doping other conductive particles, but they have not mentioned how the Ag powder is accumulated in the whole system, so we use the space accumulation theory to combine differe

Method used

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  • High-thermal conductivity conductive silver adhesive and preparation method thereof
  • High-thermal conductivity conductive silver adhesive and preparation method thereof
  • High-thermal conductivity conductive silver adhesive and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0037] (1) Mix 5 g of silicone resin and 0.25 g of heat-sensitive platinum catalyst in a mortar to prepare a matrix resin with uniform components.

[0038] (2) After mixing 0.5 g of graphite and 10 ml of acetone, sonicate at 20 to 50° C. for 3 to 6 hours, let stand for 12 hours, take the upper layer suspension, centrifuge and distill to obtain a graphene solution.

[0039] (3) Weigh 10g of flake silver, 10g of spherical silver and 0.3g of graphene solution into a beaker, add 100ml of acetone, disperse with ultrasound, ultrasonic for 15min, then centrifuge and dry to obtain conductive filler and graphene mixtures such as image 3 shown.

[0040](4) Mix the conductive filler and the matrix resin by three rollers, and add 0.75g of vinylmethylsiloxane and 0.65g of fumed silica during the mixing process.

[0041] A high thermal conductivity thermally conductive silver glue has been prepared by the above method, and its volume resistivity is 2 × 10 -5 (Ω·cm) -1 , the thermal con...

Embodiment 2

[0043] (1) Mix 5 g of epoxy resin and 0.25 g of imidazole curing agent in a mortar to prepare a matrix resin with uniform components.

[0044] (2) After mixing 0.5 g of graphite and 10 ml of acetone, sonicate at 20 to 50° C. for 3 to 6 hours, let stand for 12 hours, take the upper layer suspension, centrifuge and distill to obtain a graphene solution.

[0045] (3) Weigh 10g of flake silver, 10g of spherical silver and 0.3g of graphene solution into a beaker, add 100ml of acetone, disperse by ultrasonic, ultrasonic for 15min, then centrifuge and dry.

[0046] (4) Mix the conductive filler and the matrix resin by three rollers, and add 0.68g of a mixture of diethylene glycol monoethyl ether and ethylene glycol ether at a volume ratio of 3:1 during the mixing process, and then add 0.65g of Fumed silica, can be.

[0047] A high thermal conductivity thermally conductive silver glue was prepared by the above method, and its volume resistivity was 2.48×10 -5 (Ω·cm) -1 , the therma...

Embodiment 3

[0049] (1) Mix 10 g of silicone resin and 0.5 g of heat-sensitive platinum catalyst in a mortar to prepare a matrix resin with uniform components.

[0050] (2) After mixing 1 g of graphite and 20 ml of acetone, ultrasonicate at 20 to 50° C. for 3 to 6 hours, let stand for 12 hours, take the upper suspension, centrifuge and distill to obtain a graphene solution.

[0051] (3) Weigh 20g of flake silver, 10g of spherical silver and 0.6g of graphene solution into a beaker, add 100ml of acetone, disperse by ultrasonic, ultrasonic for 15min, then centrifuge and dry.

[0052] (4) Mix the conductive filler and the matrix resin by three rollers, and add 2.5g of a mixture of diethylene glycol monoethyl ether and ethylene glycol ether at a volume ratio of 3:1 during the mixing process, and then add 1.25g of Organic bentonite, can be.

[0053] A high thermal conductivity thermally conductive silver glue has been prepared by the above method, and its volume resistivity is 3.5×10 -5 (Ω·cm)...

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Abstract

The invention relates to a high-thermal conductivity conductive silver adhesive and a preparation method thereof. The conductive silver adhesive is prepared from the following raw materials in percentage by weight: 14-28% of organic silicon resin or epoxy resin, 0.14-1.4% of curing agent, 0.5-1% of graphene, 70-85% of conductive filler, 0.15-1.5% of diluent and 0.05-1% of reinforcing agent. The preparation method comprises the following steps of: (1) mixing the organic silicon resin or epoxy resin with the curing agent to obtain matrix resin; (2) mixing graphite and organic solvent, and performing centrifugation and distillation to obtain a graphene solution; (3) mixing the conductive filler, the graphene solution and the organic solvent, and performing centrifugation and drying to obtain the mixture of the conductive filler and graphene; and (4) mixing the mixture of the conductive filler and graphene with the matrix resin through a three-roller mill, and adding the diluent and the reinforcing agent to obtain the conductive silver adhesive. Compared with the prior art, the high-thermal conductivity conductive silver adhesive provided by the invention has relatively high electric conductivity and high thermal conductivity; and the highest using temperature of the conductive silver adhesive can reach 300 DEG C.

Description

technical field [0001] The invention relates to a composite material and a preparation method thereof, in particular to a conductive silver glue with high thermal conductivity and a preparation method thereof. Background technique [0002] Intelligence, informatization, lightness, smallness, and thinness are the development trends of the electronics industry, which are based on electronic components, and the continuous introduction of high-end materials for components has accelerated the progress of the electronics industry. High-density packaging of electronic components is an inevitable trend in the development of electronic products. During use, the heat generated will lead to an increase in chip temperature or junction temperature, and the heat conduction effect directly affects the stability of electronic product performance and the safety of use. Obviously, dissipating the generated heat to the surrounding environment through various channels is an important way to im...

Claims

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Application Information

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IPC IPC(8): C09J183/07C09J163/02C09J163/00C09J9/02
Inventor 顾哲明乔雯钰翟莲娜李小慧
Owner SHANGHAI RES INST OF MATERIALS CO LTD
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