Covering film for flexible printed circuit board and manufacturing process thereof
A flexible printing and manufacturing process technology, applied in the field of cover films for flexible printed circuit boards and their manufacturing processes, can solve the problems of large mold loss, high cost of cover films, easy warping, etc., and achieves reduced production difficulty, The effect of increased package length and reduced overall material thickness
Active Publication Date: 2015-06-24
ZHONGSHAN DONGYI HIGH TECH MATERIAL
View PDF6 Cites 0 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
[0004] The purpose of the present invention is to provide a cover film structure and manufacturing process to overcome the problems of high cost, easy warping, and large mold loss during use of the conventional cover film, which can not only realize the flatness of the film, but also greatly improve the quality of the film. Membrane Production Yield Issues
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreImage
Smart Image Click on the blue labels to locate them in the text.
Smart ImageViewing Examples
Examples
Experimental program
Comparison scheme
Effect test
Embodiment Construction
[0022] The present invention is described in detail below in conjunction with accompanying drawing:
[0023] A cover film for a flexible printed circuit board, comprising an insulating base film layer 1, an insulating adhesive layer 2 is coated on the lower surface of the insulating base film layer 1, and a release agent coating is coated on the upper surface of the insulating base film layer 1. Layer 3.
[0024] Wherein, the insulating base film layer is made of polyimide (PI) film, polyester (PET) film, polynaphthyl ester (PEN) film or liquid crystal polymer (LCP) film.
[0025] Furthermore, the preferable thickness of the insulating base film layer is 10-250um.
[0026] In addition, the insulating adhesive layer is made of epoxy resin adhesive, acrylic adhesive, polyester adhesive, polyurethane adhesive or polyimide adhesive.
[0027] Furthermore, the preferred thickness of the insulating adhesive layer is 5-65 μm.
[0028] In addition, the type of coating material of th...
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More PUM
| Property | Measurement | Unit |
|---|---|---|
| thickness | aaaaa | aaaaa |
| thickness | aaaaa | aaaaa |
Login to View More
Abstract
The invention relates to a covering film for a flexible printed circuit board. The covering film comprises an insulation basal membrane layer, an insulating gel layer is coated on the lower surface of the insulation basal membrane layer, and a parting agent coating is coated on the upper surface of the insulation basal membrane layer. A manufacturing process comprises the steps of A, preparing an insulation basal membrane, wherein an insulation basal membrane coiled material is fixed on rotating transfer equipment while guaranteeing the smoothness of the insulation basal membrane; B, coating the parting agent coating, wherein an organic solvent is utilized to mix the required parting agent component, and the coating range reaches the surface of the insulation basal membrane; C, drying, wherein an on-line drying cabinet is utilized, baking is carried out in an oven to remove the organic solvent and rapidly solidify, and the parting agent coating is formed on the insulation basal membrane; D, coating the insulating gel layer, wherein an organic solvent or inorganic solvent is utilized to mix components of all required adhesives to form a liquid state dispersing medium of an insulating gel layer, and then the other surface of the insulation basal membrane is coated; and D, drying, wherein the on-line drying cabinet is utilized, baking is carried out in an oven, the organic solvent is removed, and rapid solidification is carried out, so as to form the insulating gel layer on the insulation basal membrane.
Description
【Technical field】 [0001] The invention relates to a cover film, in particular to a cover film for a flexible printed circuit board and a manufacturing process thereof. 【Background technique】 [0002] In the cover film material for flexible printed circuit boards, release paper and release film are required. The main purpose is to prevent the insulating adhesive layer of the cover film from adhering to the insulating base film layer and cause it to be unusable. It will not be polluted by foreign impurities during production, storage and use. [0003] The commonly used production process is to apply glue on the insulating base film, and then cover it with release paper or release film for protection. In this process, higher temperature and pressure are required when the cover film and the release paper are laminated, which increases energy consumption for the user and increases the complexity of the process. Because of the introduction of release paper or release film, the s...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More Application Information
Patent Timeline
Login to View More Patent Type & Authority Patents(China)
IPC IPC(8): H05K1/02B32B27/06B32B27/28B32B37/06
Inventor 陈建平徐海斌
Owner ZHONGSHAN DONGYI HIGH TECH MATERIAL