Light Al2O3-SiC-C refractory brick and preparation method thereof
A technology of al2o3-sic-c and refractory bricks, which is applied in the field of lightweight refractory bricks, can solve the problems of not using lightweight refractory materials, and achieve excellent thermal shock stability, excellent thermal shock stability, and strong resistance to medium erosion Effect
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Examples
Embodiment 1
[0027] A light Al 2 o 3 -SiC-C refractory brick and its preparation method: 15~18wt% of porous corundum particles with a particle size of 5~3mm, 30~35wt% of porous corundum particles with a particle size of 3~1mm, 10~12wt% of porous corundum particles Porous corundum particles with a diameter of less than 1mm, 18~22% white corundum fine powder, 4~6wt% SiC particles, 4~6wt% SiC fine powder, 6~9wt% flake graphite, 1.5~2.5wt% Silicon powder and 0.2~0.6wt% aluminum powder are used as raw materials, and 3.5~5wt% liquid phenolic resin is added to the raw materials, stirred evenly, and machine-pressed; then the molded green body is processed at 220~240°C for 12 ~24 hours, then keep it warm at 1400~1450℃ and reducing atmosphere for 2~6 hours.
[0028] In this embodiment: the apparent porosity of the porous corundum particles is 25-35%, and the average pore diameter is 10-20 μm.
[0029] Adopting the technical scheme described in this embodiment, the obtained apparent porosity is 28...
Embodiment 2
[0031] A light Al 2 o 3 -SiC-C refractory brick and its preparation method: 12~15wt% of porous corundum particles with a particle size of 5~3mm, 25~30wt% of porous corundum particles with a particle size of 3~1mm, 8~10wt% of porous corundum particles Porous corundum particles with diameter less than 1mm, 22~25% tabular corundum fine powder, 6~8wt% SiC particles, 6~8wt% SiC fine powder, 9~12wt% flake graphite, 1.5~2.5wt% Silicon powder and 0.2~0.6wt% aluminum powder are used as raw materials, plus 3.5~5wt% solid phenolic resin powder of the raw materials, stirred evenly, and machine-pressed; Treat for 24~36 hours, then keep it warm at 1450~1500℃ and reducing atmosphere for 2~6 hours.
[0032] In this embodiment: the apparent porosity of the porous corundum particles is 32-40%, and the average pore diameter is 1-10 μm.
[0033] Adopting the technical scheme described in this embodiment, the obtained apparent porosity is 34~41%, and the bulk density is 2.16~2.43g / cm 3 and lig...
Embodiment 3
[0035] A light Al 2 o 3-SiC-C refractory brick and its preparation method: 12~18wt% of porous corundum particles with a particle size of 5~3mm, 28~32wt% of porous corundum particles with a particle size of 3~1mm, 9~11wt% of porous corundum particles Porous corundum particles with diameter less than 1mm, 10~12wt% white corundum fine powder, 10~12wt% platy corundum fine powder, 5~7wt% SiC particles, 5~7wt% SiC fine powder, 8~10wt% % flake graphite, 1.5~2.5wt% silicon powder and 0.2~0.6wt% aluminum powder as raw materials, plus 3.5~5wt% liquid phenolic resin of the raw materials, stir evenly, and machine press molding; then the molded The green body is treated at 210-230°C for 12-24 hours, and then kept at 1420-1470°C and reducing atmosphere for 2-6 hours.
[0036] In this embodiment: the apparent porosity of the porous corundum particles is 30-38%, and the average pore diameter is 5-15 μm.
[0037] Adopting the technical scheme described in this embodiment, the obtained appar...
PUM
Property | Measurement | Unit |
---|---|---|
Particle size | aaaaa | aaaaa |
Particle size | aaaaa | aaaaa |
Particle size | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com