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Preparation method of NPC (nano porous copper) thin films

A nanoporous copper and thin film technology, applied in the field of nanoporous metals and its preparation, can solve the problems of not being suitable for integration, etc., and achieve the effects of good uniformity, improved sputtering efficiency, and large area

Inactive Publication Date: 2013-04-03
CHANGZHOU UNIV
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This kind of porous nano-bulk metal is obviously not suitable for the development of integrated circuits, microelectronic devices and nano-devices with increasingly high integration requirements.

Method used

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  • Preparation method of NPC (nano porous copper) thin films
  • Preparation method of NPC (nano porous copper) thin films
  • Preparation method of NPC (nano porous copper) thin films

Examples

Experimental program
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Effect test

Embodiment 1

[0022] 1) Using the JGP500A BMS coating system, first fix the clean glass slide substrate on the sample tray, then install the copper target with a purity of 99.99% on the RF source, and adjust the distance between the substrate and the copper target is 15cm;

[0023] 2) Close the chamber door and evacuate to 5.0×10 -4 Pa, then pass high-purity Ar gas with a flow rate of 15sccm and a purity of 99.999%, and keep the chamber pressure at 0.1pa;

[0024] 3) Pre-sputter a 30nm-thick copper film on the glass slide with RF 100W power at room temperature and no applied bias voltage (see figure 2 (a)), as the direct substrate of NPC thin films;

[0025] 4) Under the condition of room temperature and applied bias voltage of DC–100V, the power of RF 100W was used for further sputtering deposition of 120 nm to obtain a porous triangular prism-like structure NPC thin film (see image 3 ). Among them, the cross-sectional size of the triangular prism is about 42 nm, and the width of th...

Embodiment 2

[0027] 1) Same as Example 1;

[0028] 2) Same as Example 1;

[0029] 3) Pre-sputter a 30nm-thick copper film on the glass slide with RF power of 100W at room temperature and with an applied bias voltage of DC–100V (see figure 2 (b)), as a direct substrate for NPC thin films;

[0030] 4) Under the condition of room temperature and applied bias voltage of DC-100V, the power of RF 100W was used for further sputtering deposition of 120nm to obtain a bicontinuous "triangular ligament-hole" structure NPC thin film (see Figure 4 ). Among them, the cross-sectional size of the deltoid ligament is about 21 nm, and the pore size is about 12 nm.

[0031] figure 2 (a, b) show the surface morphologies of the pre-sputtered copper film substrates in Example 1 and Example 2, respectively. from figure 2 (a) It can be seen that the surface of the copper film substrate in Example 1 is composed of some fine particles, and their surface is relatively smooth. from figure 2 (b) It can be...

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Abstract

The invention discloses a preparation method of NPC (nano porous copper) thin films, which aims to provide a magnetron sputtering preparation method of NPC thin films of a porous triangular prism shaped structure and a double continuous 'deltoid ligament-pore channel' structure and the like. According to the invention, by using a RF (radio frequency) balanced magnetron sputtering film-plating system and taking an insulating glass slide as an indirect substrate, a layer of metal copper thin film with a rough surface is deposited on the glass slide and used as a direct substrate firstly, then, a substrate negative bias is applied to the substrate, and incident copper atoms are induced to carry out selective preferential deposition on the direct substrate by using a tip current collection principle, thereby obtaining an anisotropic thin film. The shape of a NPC thin film prepared by using the method disclosed by the invention depends on the shape of a copper film of the direct substrate, so that NPC thin films with different structures can be controllably prepared through controlling the shape of the substrate. The preparation method has the advantages of simpleness in process, large area, good uniformity and anisotropy and the like, and has a potential application prospect in the fields such as solar thin-film cells, catalysis, sensors, biological detection, and the like.

Description

technical field [0001] The invention relates to nanoporous metal and a preparation method thereof, in particular to two nanoporous copper films prepared by utilizing the principle of tip current collection and preparation method thereof. Background technique [0002] Nanoporous metal (NPM) is a material with nano-sized pores, whose pore size is generally several nanometers to tens of nanometers. Nanoscale pore size enables NPMs to have higher specific surface area and unique physical, chemical and mechanical properties, which have potential applications in many technical fields such as catalysts, sensors, actuators, fuel cells, and microfluidics (see ref. : 1. Qi Z, Zhao CC, Wang XG, et al. J. Phys. Chem. C, 2009, 113: 6694). At present, the preparation methods of NPM mainly include the template method (see literature: 1. Masuda H, Fukuda K. Science, 1995, 268: 1466; 2. Attard GS, Bartlett PN, Coleman NRB, et al. Science, 1997, 278: 838), dealloying method (see references:...

Claims

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Application Information

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IPC IPC(8): C23C14/14C23C14/35
Inventor 苏江滨蒋美萍王红红
Owner CHANGZHOU UNIV
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