Heat-insulation slurry composition and applications thereof

[0054] two, Example 1-6

[0055] The components and formulation ratios of the slurry compositions in Examples 1-6 of the present invention are shown in Table 2 below.

[0056] According to the composition ratio of Examples 1-6, the thermal insulation board was prepared according to the following steps:

[0057] First weigh the reinforcing fiber and soak it with a small amount of sodium dodecylbenzene sulfonate in water at 60°C~80°C, keep stirring, and soak until it becomes a slurry; take the lightweight aggregate and soak it in water at room temperature for 1-2 hours;

[0058] According to the corresponding examples in Table 2, weigh the pretreated aqueous inorganic binder solution (numbered WNOA-1~WNOA-9), the reinforcing fiber solution, and add the magnesium-containing minerals to the mixer. And add appropriate amount of water to mix and stir to obtain slurry.

[0059] Add the filler weighed according to the corresponding embodiment in Table 2 and the pretreated lightweight aggregate into the slurry, mix, stir and disperse uniformly, and then inject it into the forming mold, vibrate at high frequency, and roll off after rolling. Mold drying (24h-36h at room temperature; drying in a tunnel kiln, 3h-5h below 50°C), to obtain the thermal insulation board provided by the present invention.

[0060] In the process of making thermal insulation boards, mixing and stirring such as pretreatment, adding fillers to the slurry, and even before the slurry is injected into the forming mold, an appropriate amount of water will be added according to the situation. In the claims of the present invention, the "appropriate amount of water" refers to the total amount of water added in all the previous processes, the "appropriate amount", and the "appropriate amount" means that the mixture before being injected into the molding mold has a certain slump Preferably, if the amount of water is too much, the mixture will easily flow in the mold, and if the amount of water is too little, the mixture will be too thick and difficult to smooth when applied. The slump mentioned above is preferably 3--4 degrees (or a water-cement ratio of 0.15-0.18 is more appropriate). Of course, the amount of water added in each of the aforementioned processes or steps should also ensure that the steps can be implemented smoothly. In principle, the "appropriate amount of water" of the present invention is consistent with the concept of "appropriate amount of water" required for preparing cement mortar or concrete mortar in the field of building materials. (The above explanation of "appropriate amount of water" is the same in the subsequent embodiments)

[0061] If necessary, low-temperature glaze modification can be made on the surface of the plate after demolding and drying. Usually, the glaze layer can be made after the surface of the plate is hardened, so that the plate can get a better decorative effect.

[0062] The test results of the thermal conductivity and fire resistance of the panels prepared in Examples 1-6 are also reflected in the respective examples. These test results show that the panel provided by the present invention has excellent thermal insulation performance and fire resistance. Good, and the density of the board is in the range of 300-550kg/m 3 Meanwhile, after testing, the compressive strength of the plate is 0.2-0.4MPa, and the flexural strength is 0.2-0.4MPa.

[0063] Table 2 Examples 1-6 (Unit: Kg)

[0064]

[0065] In the present invention, the water-based inorganic binder can form a good fusion with lightweight aggregates and fillers to enhance the strength of the board. The colloidal silicon in the water-based inorganic adhesive is the main binder, which has good flame retardant and non-combustibility properties, and the best freeze-thaw and anti-aging properties, and good long-term stability; the addition of inorganic waterproofing agent makes the final The prepared board hardly absorbs water and will not deliquesce even if it is used for a long time under damp conditions; the thickening and water-retaining agent mainly plays the role of thickening and water retention on the mixture, and has obvious water retention effect on the board, which makes the various raw materials of the board. The chemical reaction between them is more sufficient, so that the strength of the board is significantly improved.

[0066] The lightweight aggregate used in the raw material of the present invention is an inorganic material, which has the characteristics of low thermal conductivity and low density. When added to the board, the thermal conductivity and density of the entire system can be reduced, thereby improving the thermal insulation performance of the board.

[0067] The reinforcing fibers in the raw materials have the same fibrous shape and structure in appearance, low density, good thermal insulation effect, corrosion resistance, good chemical stability, non-toxic, non-polluting, and inexpensive. A network structure is formed in the board to strengthen the integrity of the board and prevent cracking.

[0068] The addition of magnesium-containing minerals mainly plays a role of retarding, and has the characteristics of early retardation during the preparation process of the board and strengthening of its strength at the end.

[0069] The preferred filler is a heat-insulating material with excellent properties such as honeycomb particles rich in vitrified hard-shell spheres, closed and smooth surfaces and hollow fine particles. Since the spherical shape is the shape with the smallest surface area under the same volume in nature, this basic The characteristics make the preferred aggregate have many physical and chemical properties that other lightweight fillers cannot match, such as high compressive strength, high melting point, high electrical resistivity, low thermal conductivity and thermal shrinkage coefficient. In the process of heat conduction, radiant heat is transferred by micro-nano-level granules, and the heat energy of infinite particles decreases layer by layer and reduces to a minimum.

[0070] three, Example 7-54

[0071] The present invention can also add one or more of inorganic powder binder, foaming agent, active agent, stabilizer to the slurry composition on the basis of Examples 1-6, and the specific slurry combination For details of the compound ratio, see Examples 7-54 in Table 3.

[0072] The thermal insulation board prepared according to Example 7-54 was completed according to the following steps:

[0073] First weigh the reinforcing fiber and soak it with a small amount of sodium dodecylbenzene sulfonate in water at 60°C~80°C. Stir continuously and soak until it becomes a slurry; take the lightweight aggregate and soak it in water at room temperature for 1-2 hours; containing magnesium Stir and mix the components in the mineral and inorganic powder binders evenly; add water to dissolve the foaming agent, active agent, and stabilizer separately for use;

[0074] Weigh the aforementioned pretreated aqueous inorganic binder solution (numbered WNOA-1~WNOA-9) and reinforcing fiber solution according to the corresponding examples in Table 3, together with those weighed according to the corresponding examples in Table 3. Magnesium-containing minerals and inorganic powder binder are added to the mixer together, and an appropriate amount of water is added to mix and stir to obtain a slurry; during the mixing process, you can also follow the specific conditions of the examples listed in Table 3. , Optionally add foaming agent, active agent, stabilizer;

[0075] Add the filler weighed according to the corresponding example in Table 3 and the pretreated lightweight aggregate into the slurry, mix, stir and disperse evenly, and then inject it into the forming mold, vibrate at high frequency, and then roll off. Mold drying (24h-36h at room temperature; drying in a tunnel kiln, 3h-5h below 50°C), to obtain the thermal insulation board provided by the present invention.

[0076] The test results of thermal conductivity and fire resistance of the boards prepared in Examples 7-54 are also reflected in the respective examples. These test results show that the board provided by the present invention has excellent thermal insulation performance and fire protection performance. Good, small specific gravity, light weight (density range 300-550kg/m 3 between).

[0077] Table 3 Example 7-54 (Unit: Kg)

[0078]

[0079]

[0080]

[0081]

[0082]

[0083]

[0084]

[0085] In the above embodiments, the water-based inorganic binder can form a good fusion with lightweight aggregates, fillers, and optional inorganic powder binders (various cements and slaked lime powder) to enhance the strength of the board.

[0086] The active agent added in the above embodiment modifies the inorganic adhesive, thereby enhancing its activity, enabling it to fully exert its energy efficiency, and thereby reducing the amount of inorganic adhesive.

[0087] The application of foaming agent can effectively reduce the surface tension of the liquid, and arrange the double electron layer on the surface of the liquid film to surround the air, forming a single bubble. The bubbles are independent of each other and uniformly distributed in the slurry, forming a large number of closed pores, showing strong three-dimensional tension, specific toughness and good compatibility. Make the board's thermal insulation performance stronger.

[0088] The addition of stabilizers can slow down the reaction, maintain chemical balance, reduce surface tension, and improve the mechanical strength and stability of the thermal insulation board.