Cover tape

一种盖带、基材层的技术，应用在薄膜/薄片状的粘合剂、应用、电气元件等方向，能够解决防静电性能下降、很难得到防静电性能、很难维持防静电性能等问题，达到稳定防静电性能的效果

Active Publication Date: 2013-04-17
DENKA CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The disadvantage of low-molecular-weight antistatic agents is that it is difficult to obtain antistatic performance sufficient to control the adhesion of dust, etc., and when the cover tape is taken up, it migrates to the surface opposite to the coated surface, thereby adversely affecting performance ( Patent Document 6)
In addition, the polymer antistatic agent also has the following problems, that is, it is easily affected by the surrounding humidity and moisture, and in a low humidity environment (atmosphere below 23°C×20%R.H.), the antistatic performance decreases (patent Documents 7, 8), based on the above problems, it is difficult to maintain sufficient antistatic performance

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0090] 42.5% by mass of styrene-butadiene block copolymer "CLEAREN" (manufactured by Denki Kagaku Kogyo Co., Ltd.) and 22.5% by mass of styrene-butadiene block copolymer "TR-2000" (manufactured by JSR Corporation) , Ethylene-α-olefin random copolymer "Tafmer-A" (manufactured by Mitsui Chemicals Co., Ltd.) 25% by mass, high-impact polystyrene: Toyo Styrene "E640N" (manufactured by Toyo Styrene Co., Ltd.) 10% by mass , pre-mixed with a tumbler, using a single-screw extruder with a diameter of 40mm to stir at 210°C, and a line speed of 20m per minute to form an adhesive layer ( figure 2 Medium, 13) resin composition. Using the resin composition for the adhesive layer, a film was formed with an extrusion blow molding machine to obtain a film having a thickness of 15 μm constituting the adhesive layer. Furthermore, a roll coater is used to form the substrate layer ( figure 2 Medium, 11) Biaxially stretched polyethylene terephthalate film (thickness 12μm) is coated with two-comp...

Embodiment 2～9、 comparative example 1～9

[0092] In addition to forming an antistatic layer according to the composition ratio as described in Table 1 and Table 2 ( figure 2 In the same manner as in Example 1 except for middle and 14), the cover tapes in Examples 2 to 3 of the present invention and the cover tapes in Comparative Examples 1 and 3 to 9 were produced. In addition, in addition to forming an antistatic layer according to the composition ratios described in Table 1 and Table 2, an adhesive layer was formed from an acrylic resin "EC-242" (manufactured by Shin-Nakamura Chemical Industry Co., Ltd.) ( figure 2 In the same manner as in Example 1 except for middle and 13), the cover tapes in Examples 4 to 9 of the present invention and the cover tape in Comparative Example 2 were produced.

[0093] For the cover tapes in Examples 1 to 9 and Comparative Examples 1 to 9, the above-mentioned various characteristics were obtained. All the results are summarized in Table 1 and Table 2.

[0094] 【Table 1】

[0095]...

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Abstract

A cover tape having at least a base material layer, and an adhesive layer that is heat sealed by a resin carrier tape, the cover tape characterized in that: the base material layer has an antistatic layer on a surface thereof that is on the reverse side to the adhesive layer; the antistatic layer contains at least an inorganic antistatic agent and a wax having a particle diameter of 0.2-3.0 [mu]m; the inorganic antistatic agent is 40%-80% by mass and the wax content is 10%-50% by mass, relative to the total components forming the antistatic layer; and the surface resistivity of the base material layer side is no more than 1013Omega / - in a 23 DEG C 30% R.H. atmosphere.

Description

technical field [0001] The present invention relates to a cover tape for packaging of electronic components. Background technique [0002] Along with the miniaturization of electronic equipment, electronic components used are also becoming smaller and higher in performance, and electronic components are automatically mounted on printed circuit boards in the assembly process of electronic equipment. The above-mentioned electronic components for chip-type surface mounting are accommodated on a carrier tape on which storage pockets thermoformed according to the shape of the electronic components are continuously formed. After storing electronic components in each storage bag, a cover tape as a covering material is stacked on top of the carrier tape, and both ends of the cover tape are continuously heat-sealed in the longitudinal direction with a heated sealing knife to form a package for electronic components. [0003] The cover tape is cut according to the width of the carrie...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B65D73/02B65D85/86C09J7/29
CPCB32B27/32B32B27/34B32B27/36B32B2405/00C09J2203/326C09J2491/006C08K3/34H01L21/6836H01L2221/68313C08K3/017C09J7/29Y10T428/25C09J2423/006C09J2467/006C09J2477/006C09J2301/41
Inventor 杉本和也德永久次弘岡忠昭
Owner DENKA CO LTD
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