Unlock instant, AI-driven research and patent intelligence for your innovation.

Film for pressure-sensitive adhesive tape and pressure-sensitive adhesive tape

A technology of pressure-sensitive adhesive tape and pressure-sensitive adhesive layer, applied in the directions of adhesives, adhesive types, chemical instruments and methods, etc., can solve problems such as operability deterioration, temperature influence, change, etc., to suppress excessive adhesion , good compatibility, good follow-up effect

Active Publication Date: 2016-12-21
NITTO DENKO CORP
View PDF5 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Occurrence of such excessive sticking leads to deterioration of operability in the case of peeling off the tape fixed to the substrate
For example, there is a problem that the smooth flow of semiconductor manufacturing processes including dicing is inhibited
However, the surface condition of this substrate film is easily affected by temperature
Therefore, there is a problem that even when the centerline surface roughness Ra of the substrate film surface is controlled to a predetermined value as reported in Japanese Patent Application Laid-Open No. 2009-239124, the centerline surface roughness Ra of the control is a predetermined value. Roughness Ra also changes significantly due to changes in air temperature and process device temperature, and cannot express the inventive effect described in Japanese Patent Application Laid-Open No. 2009-239124
Therefore, when a film to which a cross-linked silicone release agent has been coated on the back is applied to a pressure-sensitive adhesive tape, there is a problem that, when stretching the pressure-sensitive adhesive tape, such as stretching, When the layer treated with the cross-linked polysiloxane release agent cannot follow the stretching, it cannot maintain the anchoring (anchoring) performance

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Film for pressure-sensitive adhesive tape and pressure-sensitive adhesive tape
  • Film for pressure-sensitive adhesive tape and pressure-sensitive adhesive tape
  • Film for pressure-sensitive adhesive tape and pressure-sensitive adhesive tape

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0089] Hereinafter, the present invention is specifically described by way of examples. However, the present invention is by no means limited to these Examples. The term "part" means "part by weight". In addition, the amount of the reagent supplied as a solution is represented by the amount of solid content remaining after the solution evaporates (amount in terms of solid content).

[0090]

[0091] The maximum elongation is measured with an Instron type tensile tester (manufactured by Shimadzu Corporation, Autograph) according to JIS-K-7127. Specifically, a sample having a size of 20 mm wide by 100 mm long was placed with a distance between clamps of 50 mm. Then, the sample was stretched at a tensile speed of 0.3 m / min, and the value of elongation at break was measured.

[0092]

[0093] The modulus of elasticity is measured according to JIS-K-7127.

[0094]

[0095] (observed with TEM)

[0096] Processing was performed so that the cross-section of the non-pressure...

manufacture example 1

[0129] (Manufacturing example 1): Manufacture of plastic film

[0130]Polyvinyl chloride having a degree of polymerization P of 1,050 was produced by a colander method with 27 parts by weight of a DOP plasticizer (bis(2-ethylhexyl) phthalate, produced by J-PLUS Co., Ltd.) soft polyvinyl chloride film. The soft polyvinyl chloride film had a thickness of 70 μm, an elastic modulus (MD) of 250 MPa measured according to JIS-K-7127, and a maximum elongation (MD) of 400% measured according to JIS-K-7127. In addition, the film immediately after production had a surface roughness (arithmetic mean surface roughness Ra) of 0.1 μm.

Embodiment 1

[0132] 60 parts by weight of polysiloxane resin (KS-723A, manufactured by Shin-Etsu Chemical Co., Ltd.), 40 parts by weight of polysiloxane resin (KS-723B, manufactured by Shin-Etsu Chemical Co., Ltd.), 100 parts by weight of acrylic copolymer (methyl methacrylate (MMA) / butyl acrylate (BA) / hydroxyethyl acrylate (HEA)=70 / 30 / 10), 10 parts by weight Parts of tin-based catalyst (Cat-PS3, manufactured by Shin-Etsu Chemical Co., Ltd.) and 1.0 parts by weight of methylhydrogensiloxane-based curing accelerator X92-122 (manufactured by Shin-Etsu Chemical Co., Ltd.) in a solution state mix. Thus, a mixed solution (1) was obtained. The mixing ratio "polysiloxane:(meth)acrylic polymer" between polysiloxane and (meth)acrylic polymer in the mixed solution (1) was 1:1 by weight.

[0133] The mixed solution (1) was applied to one surface of the soft polyvinyl chloride film prepared in Production Example 1 and dried to form a non-pressure-sensitive film having a thickness of 1.0 μm and an ar...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
surface roughnessaaaaaaaaaa
peel strengthaaaaaaaaaa
thicknessaaaaaaaaaa
Login to View More

Abstract

The present invention relates to a film for a pressure-sensitive adhesive tape and a pressure-sensitive adhesive tape. The film for pressure-sensitive adhesive tape includes a non-pressure-sensitive adhesive layer provided on a base film, and can suppress the occurrence of excessive adhesion in the case of fixing by adsorption under negative pressure, by The non-pressure-sensitive adhesive layer is provided on the film to effectively inhibit the blocking of the film in the roll-like form, and the film is not torn or damaged when unwinding from the roll-like form, and the non-pressure-sensitive adhesive layer The sensitive adhesive layer has good compatibility with the base film, and has good followability to deformation such as stretching. There is also provided a pressure-sensitive adhesive tape comprising the film for a pressure-sensitive adhesive tape. The film for pressure-sensitive adhesive tape comprises a non-pressure-sensitive adhesive layer on one surface of a plastic film having a maximum elongation of 100% or more measured according to JIS-K-7127, wherein the non-pressure-sensitive adhesive layer is The pressure-sensitive adhesive layer has an arithmetic mean surface roughness Ra of 0.1 μm or more.

Description

technical field [0001] The present invention relates to a film for a pressure-sensitive adhesive tape and a pressure-sensitive adhesive tape. Background technique [0002] In the pressure-sensitive adhesive tape used for semiconductor dicing, it is necessary to fix the tape surface on the side opposite to the wafer-adhesive surface to the base to fix the wafer at the time of dicing. Usually, such fixation is performed under negative pressure by vacuum adsorption or the like. [0003] When such fixing is performed under negative pressure, the pressure-sensitive adhesive tape may be excessively adhered to the substrate due to a state in which negative pressure is excessively applied or the pressure-sensitive adhesive tape may be melted due to heat generated at the time of cutting. Occurrence of such excessive sticking leads to deterioration of handleability in the case of peeling off the tape fixed to the base. For example, there is a problem in that the smooth flow of semic...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): B32B27/08B32B27/30B32B7/06C09J7/02H01L21/78
CPCC09J7/22C09J7/245C09J7/385C09J7/40C09J7/401C09J133/04C09J2203/326C09J2301/302C09J2301/312H01L21/6836H01L2021/6027
Inventor 铃木俊隆由藤拓三白井稚人
Owner NITTO DENKO CORP