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Method for plating copper and tin on metal circuit board through pattern plating

A pattern electroplating and metal circuit technology, applied in the reinforcement of conductive patterns, printed circuits, printed circuit manufacturing, etc., can solve the problems of low production efficiency of tin material welding, poor product uniformity, etc., to improve performance and production efficiency, flatness High, the effect of changing the concept of the process

Inactive Publication Date: 2013-04-17
SICHUAN HAIYING ELECTRONICS TECH
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  • Description
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AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to provide a method for electroplating copper and tin on metal circuit board graphics, solve the problems of low production efficiency and poor product uniformity caused by tin material welding in the current circuit board printing process, and achieve the goal of improving product quality and production speed Purpose

Method used

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Embodiment

[0025] (A) Workpiece pretreatment of the present invention: place the workpiece on the platen, then degrease, place the workpiece in the degreasing liquid and soak for 3-8 minutes, wherein each liter of degreasing liquid contains 90-110ml concentrated sulfuric acid, 45-55ml Degreasers. Using CS-4-A or CS-4-B series degreasing agents can speed up the decomposition of grease, and perform two washings to completely remove the degreasing agents on the surface of the workpiece;

[0026] (B) Micro-etching: Place the workpiece in micro-etching solution for 1-2 minutes, in which each liter of micro-etching solution contains 40-60 sodium persulfate, 30-50ml concentrated sulfuric acid, CU 2+ The content is less than 15g / L, when CU 2+ Replace the microetching solution when the content is greater than 25g / L;

[0027] (C) The first cleaning: first wash the workpiece twice with water to completely remove the microetching solution on the surface, and then place it in the acid solution for ...

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Abstract

The invention discloses a method for plating copper and tin on a metal circuit board through pattern plating. The method comprises steps of workpiece pre-treating, micro-etching, primary cleaning, copper plating, secondary cleaning, tin plating and third cleaning. According to the method, after copper is plated, workpieces are cleaned, and tin plating operation is performed immediately; a tin welding plane is smoother through tin plating operation, so that the uniformity of a product is improved, and batch treatment can be performed; a tin plating process is adopted, so that the conventional process concept is changed, the technical bias that a PCB (Printed Circuit Board) cannot be plated with tin is eliminated, the performance of the product is improved, and the production efficiency of the product is increased; a degreasing agent of CS-4-A or CS-4-B series is taken as a mailing component in a degreasing process, so that the decomposing speed of grease can be increased, and the efficiency is further increased; and a bronzing agent is added into a copper plating solution, so that the copper surface of the product is smooth and complete and has high flatness, and the quality of the product is improved.

Description

technical field [0001] The invention relates to a method for printing a PCB circuit board, in particular to a method for electroplating copper and tin on a metal circuit board pattern. Background technique [0002] Printed circuit boards, also known as printed circuit boards, are providers of electrical connections for electronic components. Its development has a history of more than 100 years; its design is mainly layout design; the main advantage of using circuit boards is that it greatly reduces wiring and assembly errors, and improves automation and production labor rates. There are three main types of division of PCB boards: Single-Sided Boards (Single-Sided Boards). On the most basic PCB, parts are concentrated on one side, and wires are concentrated on the other side. Because the wires only appear on one side, this PCB is called a single-sided board (Single-sided). Because the single-sided board has many strict restrictions on the design circuit (because there is on...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/18H05K3/24
Inventor 卢小燕陶应辉石学权代付成
Owner SICHUAN HAIYING ELECTRONICS TECH
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