Novel preparation method for noble composite metallic bond composite wire materials

Abstract

The invention discloses a preparation method for noble / noble composite wire materials, and noble / cheap composite wire materials, wherein the preparation method is simple to operate, and the composite wire materials are controllable in thickness of a composite layer, clean in limiting surface, good in limiting surface bonding and easy to process subsequently. The preparation process includes that an outer layer of metal is machined to a round pipe by ingot casting, extruding and drawing, and wall thickness is designed according to demand of product design. The noble metal round pipe is placed in a water-cooling mold, core material metal is placed in a vacuum induction melting furnace to be melted, core material molten metal is poured into the water-cooling mode to be fast set, the water-cooling mold is adjusted, and cooling speed of the core material molten metal is changed so as to produce a composite bar of clad materials and a core material binding layer (a transition layer). The composite bar is machined through rotary swaging, and is carried out with heat treatment and wire drawing in the middle process to meet product size requirements of customers. The composite wire materials are wrapped evenly by outer layer metal, and the wrapping layer and the core materials are good in cooperated transformation. The wrapping materials and the core materials are closely combined. The wrapping materials can be used for advanced packing of an integrated circuit and the like, and part of wrapping materials or all wrapping materials can replace the noble metallic bond composite wire materials.

Description

technical field [0001] The invention belongs to the technical field of composite materials, and in particular provides a method for a precious metal composite bonding wire for semiconductor packaging. It can be used in the preparation of noble / noble composite bonding wires and noble / base composite bonding wires, and can also be popularized and applied to the preparation of other composite metal wires. Background technique [0002] With the development of integrated circuit and semiconductor device packaging technology towards multi-lead, high integration and miniaturization, packaging materials require the use of bonding wires with thinner wire diameters and better electrochemical performance for narrow-pitch and long-distance bonding. . At the same time, in order to reduce production costs, it is hoped that base metals can be used instead of precious metals. [0003] So far, the methods for combining two or more materials into one body and suitable for large-scale product...

AI Technical Summary

Problems solved by technology

This kind of method is beneficial to solidification feeding and rolling processing. Generally, the outer metal liquid is attached to the core material to solidify or the core metal liquid is solidified in the outer metal tube, but there are certain limitations. For example, only thick The cladding composite material of the wall, the core-filling continuous casting is only suitable for composite materials with the melting point of the outer metal higher than the melting point of the core material, etc.