Solder, preparation method thereof and method for connecting sapphire and niobium or niobium alloys by using solder

A technology of sapphire and niobium alloy, applied in welding medium, manufacturing tools, welding equipment, etc., can solve the problems of large residual stress in joints, complex process, low joint strength, etc., and achieve the effect of relieving residual stress and simple process

Inactive Publication Date: 2013-04-24
HARBIN INST OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] The present invention aims to solve the problems that the existing brazing method for connecting sapphire and metal has relatively large residual stress, high temperature resistance, complicated process and low joint strength, and provides a brazing filler metal and its preparation method and Method for connecting sapphire and niobium or niobium alloy by solder

Method used

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  • Solder, preparation method thereof and method for connecting sapphire and niobium or niobium alloys by using solder

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specific Embodiment approach 1

[0016] Specific embodiment one: present embodiment is a kind of solder, and it is made of Ag powder, CuO powder, TiH 2 Powder, Si 3 N 4 Prepared by nano-ceramic particles and a binder; wherein, the mass ratio of the Ag powder to the CuO powder is 1: (0.06~0.17), and the Ag powder to the TiH 2 The mass ratio of powder is 1:(0.01~0.11), the Ag powder and Si 3 N 4 The mass ratio of the nano-ceramic particles is 1:(0.012-0.12), and the mass ratio of the Ag powder to the binder is 1:(0.05-0.07).

[0017] In this embodiment, TiH is selected 2 As an added form of active Ti, TiH 2 Activated Ti can be completely decomposed by vacuum heating and dehydrogenation, effectively preventing active Ti from being oxidized.

[0018] This embodiment has the following advantages: when the brazing filler metal provided by this embodiment is used to connect sapphire and niobium or niobium alloy, since nano-ceramic phase particles are added to the brazing filler metal, the residual stress cause...

specific Embodiment approach 2

[0019] Specific embodiment 2: The difference between this embodiment and specific embodiment 1 is that the binder is formed by mixing glycerol, hydroxyethyl cellulose and water; wherein, the glycerin The mass ratio to hydroxyethyl cellulose is 1: (3-7), and the mass ratio of glycerol to water is 1: (90-92). Others are the same as in the first embodiment.

specific Embodiment approach 3

[0020] Embodiment 3: The difference between this embodiment and Embodiment 1 or 2 is that the mass ratio of the Ag powder to the binder is 1:0.06. Others are the same as in the first or second embodiment.

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Abstract

The invention discloses a solder, a preparation method thereof and a method for connecting sapphire and niobium or a niobium alloy by using the solder, relates to the field of solders, preparation methods thereof and connection methods and aim to solve the problems that in the prior art an connector has larger residual stress by using a brazing method for connecting the sapphire and metals, the connector can't resist high temperature, the process is complex and the strength of the connector is not high. The solder is prepared by Ag powder, CuO powder, TiH2 powder, Si3N4 ceramic nanoparticles and a binder. The preparation method of the solder includes the steps of (1) preparing Ag-CuO-TiH2 powder; (2) preparing mixed powder of the solder; and (3) uniformly mixing the mixed powder of the solder with the binder. The method for connecting the sapphire and the niobium or the niobium alloy by using the solder includes the steps of (1) preparing a sapphire sample to be welded and a niobium sample or a niobium alloy sample which are to be welded; (2) coating the solder on the surfaces to be welded, and (3) completing the connection of the sapphire and the niobium or the niobium alloy by means of segmented heating. The solder, the preparation method thereof and the method for connecting the sapphire and the niobium or the niobium alloy by using the solder is applicable to the field of welding.

Description

technical field [0001] The present invention relates to the field of brazing filler metals and methods for their preparation and joining. Background technique [0002] Sapphire is α-Al 2 o 3 Single crystal is an excellent crystal material with excellent physical, mechanical and chemical properties such as high strength, high thermal shock resistance, high corrosion resistance and high wave transmittance. It is considered to be an ideal material for satellite optical windows. However, because it is a single crystal material of alumina, the price is relatively expensive, and its application needs to be inevitably connected with metals, such as niobium, Kovar alloy and carbon steel. At present, the connection methods of sapphire and metal mainly include brazing, diffusion welding, glass welding, adhesive bonding and mechanical connection. Diffusion welding joints have relatively high strength, but the connection time is long and the cost is high, and the pores in the weld wi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/30B23K35/34B23K35/363B23K1/008
Inventor 李卓然徐晓龙刘睿华申忠科刘羽
Owner HARBIN INST OF TECH
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