Pressure-sensitive adhesive tape for heat dissipation and preparation method thereof

Abstract

The invention discloses a pressure-sensitive adhesive tape for heat dissipation and a preparation method thereof. The adhesive tape comprises a polyethylene terephthalate (PET) film, wherein a heat and electricity conducting adhesive layer is coated on the lower surface of the PET film and consists of the following components in part by weight: 50 to 150 parts of graphite powder, 50 to 150 parts of organic silicon, 10 to 100 parts of polyfunctional acrylate monomer, 0.1 to 1 part of initiator and 50 to 300 parts of solvent; the initiator is a mixture of azodiisobutyronitrile and benzoyl peroxide; the solvent consists of the following components in part by weight: 50 to 150 parts of toluene, 50 to 150 parts of ethyl acetate and 50 to 150 parts of butanone; the thickness ratio of the PET film to the heat and electricity conducting adhesive layer to an aluminum foil layer is 100:(100-300):(10-100); and the diameter of the graphite powder is 3 to 6mu m. Heat conductivity is greatly improved in the length and thickness directions, the pressure-sensitive adhesive tape has antistatic property and can be in contact with and adhered to an electronic device for a long time, the stability of heat dissipation performance is achieved, and the service life of the adhesive tape is further prolonged.

Description

technical field [0001] The invention relates to a heat-dissipating pressure-sensitive adhesive tape and a preparation method thereof, belonging to the technical field of adhesive materials. Background technique [0002] With the rapid development of the electronics industry, from ordinary desktop computers to notebook computers, tablet computers, and smart phones, technological innovation is advancing by leaps and bounds. Electronic products are becoming more portable, smaller in size, and more powerful in function, which leads to higher integration. This leads to shrinking volume and stronger functions, which directly leads to higher and higher heat dissipation requirements of electronic components. However, the fan-type heat dissipation used in the past was gradually eliminated by the market due to its large size and noise. Then there are other heat dissipation materials, such as copper foil and aluminum foil, but due to limited resources and high prices, the heat dissip...

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Problems solved by technology

This leads to shrinking volume and stronger functions, which directly leads to higher and higher heat dissipation requirements of electronic components.

However, the fan type heat dissipation used in the past was gradually eliminated by the market due to its large size and noise.

In turn, other heat dissipation materials have been produced, such as copper foil and aluminum foil heat dissipation. However, due to limited resources and high prices, the heat dissipation effect is not as good as imagined. Slowly, they are all looking for new and efficient heat dissipation materials.

Secondly, due to the diversity of electronic products, existing products often need to be customized, which makes it difficult to apply to specific use occasions and limits the promotion of its application; Thermally conductive and antistatic pressure-sensitive adhesive tapes have become the direction of efforts of ordinary skilled in the art

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